Besi
Datacon introduces new machine
Welcome to the world of Besi
BE Semiconductor Industries N.V. and its subsidiaries Datacon, Esec, Fico and Meco, is a leading manufacturer of semiconductor die sorting, flip chip and multi-chip die bonding, wire bonding, packaging and plating equipment, for both array connect and leadframe assembly processes.
- 26 Apr 2012
- Dividend Financial Year 2011
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- 25 Apr 2012
- Besi Reports Q1-12 Revenue and Profit That Meet or Exceed Expectations.
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- 03 - 25 May 2012
- Dividend: Election Period
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- 25 May 2012
- Dividend: Determination exchange ratio.
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Datacon 2200 evo plus
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Datacon 2200 evo
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Datacon 8800 FC QUANTUM
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Datacon 8800 CHAMEO
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Datacon 8800 Smart Line
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Esec 2009 SSI E
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Esec 2009 fSE - NEW!
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Wire Bonder Service Center
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Esec 3200 SC
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Esec 2100 xP
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Esec 2100 sD
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Esec 2008 SC3 plus
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Esec 2008 hS plus
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Esec 2100 FC
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Fico Compact Line
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Fico Sawing Line
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Fico AMS-W
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Fico AMS-W Top Foil
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Fico ISS
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Fico MMS-W Top Foil
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Fico AMS-i
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Fico MMS-i
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Meco Connector Plating
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Meco PPL
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Meco FAP
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Meco DPL
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Meco R2R Solar
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Meco ACP
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Meco RTR Ag
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Meco CPL
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Meco EDF/EPL
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- © 2012 Besi
- Stock-Ticker 18/05/2012 at 05:35 pm CET 5.60 EUR +0.07 (+1.27 %)