Company
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries. Through its product groups Datacon (Die Attach), Esec (Die Bonding), Fico (Packaging) and Meco (Plating), Besi develops and markets leading edge assembly processes and equipment for leadframe, array connect and wafer level packaging applications. Besi products cover a wide range of end-use markets such as electronics, computer, automotive, industrial, RFID, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.
