Company Overview
Besi's assembly equipment product portfolio is designed, developed and managed from locations in Europe and North America. The principal brand names for Besi's assembly systems include Datacon, Esec, Fico and Meco. Set forth below is a summary of Besi's product groups and the products produced under each brand name.
Die Attach Equipment Product Group
Besi Austria GmbH
Besi Austria GmbH (formerly Datacon Technology GmbH), based in Radfeld, Austria, is a leader in the design, development and production of component, multi chip and flip chip die bonding systems for the assembly equipment market. In addition, it produces die sorting systems under the Datacon brand name from facilities located in Salem, New Hampshire, USA.
Besi Switzerland AG
Besi Switzerland AG (formerly Esec AG), based in Cham, Switzerland, is a leader in the production of epoxy, flip chip and soft solder die bonding systems for the assembly equipment market.
Packaging Equipment Product Group
Besi Netherlands B.V.
Besi Netherlands B.V. (formerly Fico B.V.), based in Duiven, the Netherlands, produces molding, trim & form and singulation systems for both leadframe and advanced packaging applications. All equipment, tools, molds and mold kits are produced in Besi's Shah Alam, Malaysia and/or Leshan, China facilities.
Plating Equipment Product Group
Meco Equipment Engineers B.V.
Meco Equipment Engineers B.V., based in Drunen, the Netherlands, produces tin, copper and precious metal plating systems for applications in the semiconductor and solar industries.
Wire Bonding Equipment Product Group
Besi Switzerland AG
Besi Switzerland AG, based in Cham, Switzerland, delivers wire bonders for smart card applications from facilities located in Singapore.