Company Overview
Besi develops and engineers assembly equipment for the global semiconductor and electronics industries. Besi’s product lines Datacon, Esec, Fico and Meco combine unique knowledge in leading-edge assembly processes for leadframe, array connect and wafer level packaging applications. The high-technology assembly equipment thus guarantees high productivity and quality at low cost of ownership.
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Datacon
Datacon is one of the most innovative companies in the area of advanced packaging and multi chip bonding.
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Esec
As technology partner in the semiconductor industry, Esec enjoys a high profile due to its unique process knowledge.
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Fico
Fico offers molding, trim & form and singulation systems. These reliable systems can process a wide variety of packages.
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Meco
Meco designs and manufactures plating systems to suit a wide variety of products.