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Events & Shows

20 Apr 2017 - 21 Apr 2017

Advanced Packaging & System Integration Technology

For the 3rd time, Yole Développement & NCAP partner to organize the Advanced Packaging Symposium focused on Advanced Packaging & System Integration Technology. This symposium is an unparalleled gathering of the leading executives from around the world discussing the timeliest issues, challenges and opportunities. The unique single-meeting event will take place in one of the most dynamic place in the field of advanced packaging: Wuxi, China, from April 20 to 21, 2017 Win a drone in the lucky draw!!

Advanced Packaging & System Integration Technology

2 days - 5 sessions - 22 impressive presentations

Yole Développement and NCAP are excited to officially announce the preliminary agenda for the upcoming Advanced Packaging & System Integration Technology (April 20-21 - Pullman Wuxi New Lake Hotel, Wuxi, China). Download the program's initial brochure.

During the two-day symposium attendees will hear almost 22 talks that have been divided into five sessions, one interactive panel session and networking times.

Find out more:

  • Fan Out Packaging: from Integration to IP with Huawei (keynote), Huatian Technology (Kunshan) Electronics, nepes,.. 
  • 3D Integration & Processes for Advanced Packaging with BroadPak Corporation, Kobus,... 
  • Equipment for Advanced Packaging Platforms with Besi, Unity SC,... 
  • Advanced Materials & Processes with Brewer Science (keynote), DISCO Corp., SPTS, Plasma-Therm,... 
  • Applicative Packaging & Materials with Infineon Technologies, Dow Electronics Materials,...

Experts from the advanced packaging area are preparing for a symposium that has yet to find its equal, as this is the place to exchange experiences and ideas that might shape the industry's future and meet Chinese companies. Find more information on the event webpage. Register for your ticket now.

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