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Company Profile |
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BE Semiconductor Industries N.V. and its subsidiaries is a leading manufacturer of semiconductor die sorting, flip chip and multi-chip die bonding, packaging and plating equipment, for both array connect and leadframe assembly processes. Our technologically advanced equipment and integrated systems are used principally to produce semiconductor assemblies or “packages”, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. Our innovative systems offer customers high productivity and improved yields of defect-free devices at a low total cost of ownership. Our products are used to assemble chips for a wide variety of end-use applications including electronics, computer, automotive, industrial, RFID (“Radio Frequency Identification Device”) and solar energy.
Our customers are primarily leading U.S., European and Asian semiconductor manufacturers, assembly subcontractors and electronics and industrial companies including Amkor, ASE, Chipmos, Epcos, Fairchild, Hynix, Infineon, Osram, UTAC, Robert Bosch, Samsung, Siliconware, Skyworks, STMicroelectronics and Texas Instruments. Our equipment performs critical functions in our customers’ semiconductor assembly operations and in many cases represents a significant percentage of their installed base of assembly equipment. Our business has benefited from close, long-term relationships with our customers, many of whom have been purchasing our equipment and services for over 35 years.
Besi was incorporated under the....
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Press |
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July 24, 2008
BE Semiconductor Industries 2008 Second Quarter Results Release and Conference Call Date
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June 4, 2008
BE Semiconductor Industries Announces Die Bonding Equipment Orders
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