Die Attach
Setting Future Industry Standards Today
As one of the leaders in die attach for more than two decades, Besi is committed to surpassing its customers’ needs by constantly setting new industry standards in die attach. Its die attach platforms constantly demonstrate the company’s innovation strength and set already today the future industry standards. Besi’s die sorting equipment incorporate advanced technologies and cover a wide variety of processes.
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Advanced Packaging
Datacon’s advanced packaging system provides ultimate flexibility for die attach, multichip and flip chip applications.
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Die Bonding
The innovative die attach systems by Datacon and Esec cover a wide range of applications meeting tomorrow’s challenges.
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Soft Solder Die Bonding
Esec offers proven and fully automated soft solder die attach equipment for the power semiconductor mass market.
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Die Sorting
Datacon’s advanced die sorting technologies cover die sorting into tape reel, tape frame, chip tray, and other carriers.
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Flip Chip
Besi offers flip chip systems for mass production as well as for the high-end sector, covering a wide range of flip chip processes.