Esec 2008 SC3 plus
The Die Bonder 2008 SC3plus is the high-speed platform for high volume smart card production ready for 300 mm wafers. The platform can process different types of endless Smart Card tapes. It handles 6" to 12" (300 mm) wafers and guarantees repeatable constant bonding quality, independent of the user. Operators love to run this Esec machine because of the easy access to every module.
High UPH – Up to 13’000 Cycles
- Ultra fast vision system
- High-speed pick & place with constant force bond head (0.2 to 50N)
- Fast and save pick-up process
- “2-in-1” dispensing system with programmable pneumatic dispenser (printing & writing)
- Full recipe capability
Smart Control and Interface
- Fast and easy chip learning
- Wafer map display and conversion
- Short recipe download time
- On-machine documentation with self explaining service videos
- Operator-friendly machine design and easy access to all modules
Wide Application Range
- Standard smart card tapes
- Passport inlays
- Heated process plates for WBL applications
- Tape index steo (pitch) up to 86 mm
Handling of all known Packaging Tasks
- Flexible wafer handling system processing the whole range (from 6” to 12”)
- Thin die capability down to 2 μm
- Small die epoxy writing
- Wafer backside lamination, “2-in-1” and standard wafer tapes
| Productivity | up to 13,000 cycles per hour (depending on configuration and application) |
|---|---|
| Bonding accuracy | 45 µm @ 3 sigma 25 µm @ 3 sigma (with optical bond centering) |
| Tape dimensions | Width: 12 - 70mm Thickness: 0.1 - 0.4mm Pitch: max. 80 mm |
| Wafer size | Up to 12" |
| Die size | 40 x 40 mils to 1x1" 1 x 1 mm to 25.4 x 25.4 mm |
| Dispenser | Programmable Pneumatic Dispenser Programmable Showerhaed Dispenser |
|---|---|
| Vision Systems | Parallel Pre-Bond IQC (integrated Quality Control) Post-Bond IQC Rejected Pad Sensor |
| Material Handling | Reel In Reel In Control Reel Out Reel Out Control Buffer Buffer Compact |
| Curing | Compact Curing Compact Curing, integrated Exhaust Curing Oven Curing Oven with Rail |
| Miscellaneous Options | Uninterruptible Power Supply Wafer Mapping Package Host Package |
For additional details please contact your sales team