Esec 2100 xP
The new epoxy Die Bonder 2100 xP is the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. This innovative platform was awarded with the prestigious Swiss Technology Award in 2008.
Leading Edge Machine Concept
- 3 fully decoupled process stations allow to handle any substrate up to 300 mm length without any restrictions
- Reloading of material from the front while machine is in full operation
- Key alignment tasks performed by cameras make many mechanical adjustments obsolete
Highest uptime
- Real time process monitoring through 4 live images of process zones
- Constant status control with real time wafer, strip and magazine viewer
- Efficient learning and error recovery thanks to context sensitive online help
Highest speed at 20 µm accuracy
- 167 ms pick & place cycle time due to the revolutionary Phi-Y mechanism combining rotational with linear movements
- Placement accuracy of 20 µm (3 sigma) through vibration control
- Highest stiffness for highest speed AND accuracy
Fastest time to yield
- Toolless exchange of product specific parts for fastest product changeovers
- Teach and setup wizards and parameter teach verification eliminate setup errors
- Recipe transfer from machine to machine enables fast conversion
The platform of the future
- Handles all high-end epoxy processes on strip for substrate lengths up to 300 mm
- 50 N bondforce standard
- Third process station enables easy adaptation to future leading-edge applications
| Bonding method | Epoxy |
|---|---|
| Cycle time | 167 ms |
| Bonding accuracy | 20μ (3σ) |
| Wafer size | 4“ to 12“ (on 8“ or 12“ wafer frames) |
| Die size | 0.5mm to 25mm |
| Leadframe size | Length: 120mm to 300mm Width 15mm to 128mm |
| Machine dimensions | 1785 x 1448 x 1400 mm (W x D x H) |
| Substrate Handler (SH) Dual Input (MHIN and TOS) Magazine Handler Input (MHIN only) Rail Downholder Motorized Downholder Disp/Bond Strip Marking Unit Striphandler 84mm cold taped QFN Striphandler 84mm hot 1 zone SMEMA Link Input SMEMA Link Output |
DINP MHIN RADO MODDB * SMU STH84c tQFN STH84h 1Z SMEMIN* SMEMOUT * CSR required |
| Dispenser (DI) PDS Epoxy Level Detection |
PELD |
| Die Carrier (DC) Ionizer |
ION |
| Vision (VI) Indirect Illumination (BVI/DVI) Dispense Quality Check Bond Quality Check |
IILL DQC BQC |
| Automation Wafer Mapping incl. Conversion Host Communication Interface |
WMP HOST |
For additional details please contact your sales team