Flip Chip
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Esec 2100 FC
Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100...
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Datacon 8800 FC QUANTUM
The 8800 platform offers a solution for high-volume flip chip production combining high accuracy with high flexibility. The 8800 FC QUANTUM supports...
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Datacon 8800 CHAMEO
The 8800 CHAMEO is the pioneer multi-chip flip chip platform, enabling single pass production for higher accuracy and higher yield. In addition, this...
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Datacon 8800 Smart Line
With its 8800 Smart Line, Datacon provides an excellent equipment for high-volume RFID production. This flexible, cost effective, easy-to-use work...