Datacon 8800 CHAMEO
The 8800 CHAMEO is the pioneer multi-chip flip chip platform, enabling single pass production for higher accuracy and higher yield. In addition, this machine provides advanced interconnection options: heated bond heads and work holders, ultrasonic and thermosonic as well as thermocompression options, wafer chucks for chip-to-wafer bonding and more.
Multichip – Combining Speed, Flexibility and Accuracy
- Multichip capability – Flexibility on smallest footprint
- Single pass is king – Improve your Cpk for multi-FC packages
- Waffle pack feeders – Extend your possibilities
Enhanced Capabilities – Ready for the Future
- Ultrasonic, thermosonic, thermo-compression – No limits for your applications
- Lead frame, strip, boat, wafer – No limits for your substrates
- Customized features – Exactly tailored for your process
Highest Accuracy – Capturing Tomorrow’s Markets
- Highest Accuracy ± 6µm @ 3 Sigma – For fine-pitch and TSV applications
- Local reflow – Mastering sophisticated assemblies
- Long-term stability – Securing high yield at high speed
Wafer Level Applications
- Fan-Out Wafer Level Packages – Highest performance for lowest cost
- Advanced Chip to Wafer – Cost effective dual die stacking
- Through Silicon Vias (TSV) – Entry ticket to the future
| Machine capability |
| X/Y placement accuracy |
+/- 6 µm @ 3 sigma |
| Bond force |
0 – 7,500 g (programmable) |
| Multichip capability |
Software & tool changer included |
| Ultrasonic bond head |
optional |
| FO-WLP capability |
optional |
| Wafer |
| Die size |
0.5 mm – 50 mm |
| Die thickness |
0.02 mm – 7 mm |
| Wafer size |
4“ – 12“ (on 8“ or 12“ wafer frames) |
| Substrates & Carriers |
| Types |
FR4, ceramic, BGA, strip, flex, boat, lead frame |
| Working range |
13“ x 12“ |
| Slide Fluxer |
| Flux film thickness |
Various cavity plates available |
| Size & Weight |
| Size |
W 1,600 mm x D 1,200 mm x H 1,450 mm |
| Weight |
2,000 kg |
Die handling
- Heated bond head
- High-precision heated tool holder
- Ultrasonic bond head
- Waffle pack feeder 2”/4”
- Static waffle pack station
- High accuracy capability
Substrate / strip handling
- Heated workholder
- Input/output buffer
- Magazine lift ML1
- 14” Wide transport system
- Vision System
- RGB lighting
- OCR recognition for substrates
Software
- Wafer mapping host
- Substrate mapping
- FO-WLP software
For additional details please contact your sales team
