Datacon 8800 Smart Line
With its 8800 Smart Line, Datacon provides an excellent equipment for high-volume RFID production. This flexible, cost effective, easy-to-use work horse provides sufficient capabilities for high yield production, and integrates Datacon’s vast RFID process know-how.
Equipment
The 8800 Smart Line from Datacon is a perfect assembly line for RFID inlay production, both for HF and UHF tags. This easy-to-operate equipment supports a robust assembly process with the biggest process windows – a major requirement for a high volume production environment where operators without advanced education are expected to serve up to five assembly lines each.
Assembly Process
All the process parameters of the 8800 Smart Line have already been optimzed in order to achieve the highest productivity, the biggest process windows, and a reliable assembly. They are stored in a software recipe which can simply be loaded before production start.
A high-speed dispensing system with ± 25 µm accuracy provides stable adhesive application with the lowest material consumption. The outstanding small die capability (down to 0.3 mm die size) an exceptional accuracy of 15 µm @ 3s, and the standard capability for processing of 6”, 8”, and even 12” wafers makes the 8800 Smart Line a future-safe investment.
A precisely controlled thermode curing system supports the state-of-the-art ACP assembly process (anisotropic conductive adhesive), and an inline test system enables testing of the assembled inlays and identifies non-functional parts. The 8800 Smart Line is the most flexible chip assembly line on the market, and customers who run low volume/high mix production lots significantly benefit from production change-over times of less than one hour.
TTT - Total Tag Technology (TM)
For information about the TTT cooperation project, see the rfid-ttt.com web site.
| Core specifications | |
|---|---|
| Applications | Direct & indirect chip attach (both antenna web and strap) |
| Interconnect process | ACP, NCP |
| Throughput | Up to 10,000 UPH (application dependant) |
| Accuracy | 25 µm @ 3s high speed, (15 µm @ 3s accuracy mode) |
| Substrate | Endless, up to 15" width, 12" x 12" bond area |
| Dispenser | High-speed dot dispensing system |
| Curing | Heated press (optional: inline oven) |
| Inspection | Upward inspection, post dispense, post bond iinspection |
| Substrate handling | |
|---|---|
| Substrate material | Various polymers, e.g. PET; suitable papers |
| Min. width | 35 mm (1.38“) |
| Max. width | 381 mm (15") |
| Inner diameter of reel | 76.2 mm (3") |
| Max. diameter of reel | 600 mm (23.6") |
| Wafer and Die handling | |
|---|---|
| Die presentation | Diced wafer on film frame carrier |
| Wafer size | 6“ – 12“ (on 8“ or 12“ wafer frames) |
| Die size | 0.8 mm – 50 mm |
| Die thickness | 0.02 mm – 7 mm |
Web transport
- Unwinder / Rewinder
- Reel-to-reel transport system
- Inline slitting option
- Offline slitter
Wafer handling
- Automatic wafer changer
- Wafer stretcher
Test System
- HF reader
- UHF reader
For additional details please contact your sales team