Esec 2100 FC
Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders: Esec’s response to driving down the cost of flip chip technology.
Highest UPH – No Time Wasted
- Simultaneous movement of chip and camera – no time wasted for image taking
- Low vibrations – no time wasted for motion settling
- Innovative parallel activity machine design with Phi-Y movement pick-and-place
- Focused on strip based products
Load & Run – Shortest Time to Yield
- Load recipe from host and run on any machine
- Full recipe transfer from machine to machine
- Operator independent results ensured by auto calibration
Highest Up Time – Consistent Quality
- Reliable and accurate flip chip process
- Smart and safe wafer mapping
2100 Platform Synergies – Reduced Operating Cost
- One compact flip module is all that makes the difference to epoxy die bonders of the 2100 platform
- Most spare parts are the same – lean stock and high availability
- Flexible workforce – cross-trained operators and support teams
| Bonding method | Flip Chip |
|---|---|
| Bonding accuracy | down to 10 μm (3σ) |
| Min. Cycle time | 400 ms |
| Wafer size | 4” to 12” |
| Frame size | 6", 8” and 12” |
| Die size | 0.5 … 25 mm / 20 mils … 1 inch |
| Die thickness | ≥ 0.1 mm / ≥ 4mils |
| Strip dimensions | Length up to 500 mm Width up to 125 mm (flat boats up to 137 mm) |
| Machine dimensions | 1430 x 1440 x 1400 mm (W x D x H) |
| Weigth | approx. 1'400 kg / 3'000 lb |
| Substrate Handler |
|
| Slide Fluxer |
| Dispenser |
| Ionizers in Pick and Bond |
| Quality Check Cameras with Sophisticated Image Analysis Software |
| Automation |
|
| Uninterruptible Power Supply to PC |
For additional details please contact your sales team