Soft Solder Die Bonding
Leading-Edge Soft Solder Technology
Esec is a Besi product group and a globally leading designer and supplier of fully automated soft solder die attach equipment for the power semiconductor mass market. Its more than 30 years of experience and broad base of installed soft solder systems makes Esec a valuable partner for your current and future power applications.
Today’s power devices used in communications, automotive, computers, home appliances and handheld devices have entered a new era of miniaturisation. This development requires more power dissipation in small packages and asks for a more stringent process control. Esec is teaming up with key customers and major material suppliers to forge an optimum power packaging solution. Our patented Soft Solder Process Technologies ensure our customers leading position.
-
Esec 2009 SSI E
The new Die Bonder 2009 SSI E is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control...
-
Esec 2009 fSE - NEW!
The Esec 2009 fSE is the fastest soft solder die bonder in the industry with a broad application range. First to mention the point-to-line Pick &...