Esec 2009 SSI E
The new Die Bonder 2009 SSI E is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are unmatched in the industry. Thanks to the patented soft solder process technologies the Die Bonder 2009 SSI ensures your leading market position.
Highest Speed
- New point to line pick & place
- High speed high accuracy dispensing technology
Best Process Quality
- Lowest gas consumption
- Patented dispensing and bonding technology
- Process visualization
Widest Application Range
- Solution to handle the ultra thin and ultra wide leadframes
- Solution to process power modules
Fastest Time to Yield
- Fast product change over with exchangeable indexer
- User friendly menu structure
- Easy to use mechanical design
Co-Development
- Involve in power package design
- Work closely together with customers and suppliers
Ready for the Future
- Expandable machine design
- Multi process capability
- Ultra thin die handling
| Net Productivity | 2,500 to 8,000 UPH typical |
|---|---|
| Bonding Accuracy | 20µm @ 1 sigma |
| Solder Wire Spools | Diameter: max. 155mm / 6.1” Width: max 12mm / 0.47” Mounting hole: 8mm to 10.5mm / 0.31” to 0.41” |
| Wafer Size | up to 8" |
| Die Size | 1 x 1mm to 11 x 11mm 40 x 40 mils to 430 x 430 mils |
| Machine Dimensions | 1970 x 1305 x 1760 mm (W x D x H) |
Handling
|
Dispenser
|
|
Vision
|
Misc. Options / Special Applications
|
For additional details please contact your sales team