Wire Bonding
During the past few years, Esec has established itself as the market leader in the wire bonder business for smart card applications. With its leading position based on a wide customer portfolio, Esec provides their business partners with complete customer specific-endless solutions.
To interconnect chips to endless substrates requires ever faster, flexible and reliable wire bonder equipment. Therefore, the strongest emphasis is put on economical production methods and highest quality standards. Esec’s ball bonder for endless applications, the Wire Bonder 3100 SC, meets all these challenges.
