Esec 3200 SC

Today’s market proven Esec Wire Bonder 3200 SC is widely received by the world’s major Smart Card Technology leaders. The Wire Bonder 3200 SC has enabled the smart card packaging requirement to the next level with stable wire bonding process capabilities, stringent wire looping requirement and optimal yield throughput. With a market share of more than 90% Esec is not only the market leader, but also sets again the industry standard.

Esec WB 3200 SC
NEW Features
  • Increased productivity of up to 12% compared with 3100 SC (previous generation)
  • Increased bond range at higher accuracy
  • Full set of advanced features (ACNSD, SuperRes, Bond modes)
  • Adaptive OSC
  • New MPU with faster HMI response
  • Enhanced copper EFO handling (rotary design), copper light option
Additional Features
  • Friction-less air bearing TY bondhead technology: highest accuracy & speed at lowest maintenance cost
  • Reliable RIC / ROC design: lowest maintenance cost at highest uptime
  • Integrated programmable focus for highest flexibility
  • Most ergonomic user interface significantly reduces learning time
  • Large bond range of 60 x 70 mm enables highest productivity
  • State-of-the-art electronics and controlling systems: highest perfomance & flexibility
Productivity (UPH)
UPH max.
Wire cycle time (m/sec):

7'240 (with increased DRF)
48m/sec @ 2.0 mm                              

Bonding System
Bonding area (X x Y mm):
Bond placement accuracy (μm):
Ultra low loop height (μm):
60 x 70
± 2.1 μm @ 3 sigma                                                   
50 ~75
Wire

Max. wire length (mil):
US frequency (KHz):
X-Y table resolution (μm):
Z resolution (μm):
Wire diameter (mil):

360
128
0.02
0.02
0.6 ~2.0                                                       

Material Handling Capability
Width (mm):
Length (mm):
Thickness (mm):
Heater element (Pre/ Bond/ Post):
Indexer clamp:
Max. reel outer diameter:
Max. reel width:
Max reel weight:
Reel rotating speed:
Buffer configuration:
15 - 84
100 - 270
0.1 - 0.8
2 / 2 / 2
Dual
800 mm
90 mm
30 kg
programmable
available                                                                            
Special Functions
Programmable optic:
Non-stick detection:
Bond inspection function:
OLP function:
Cu wire capability:
Automatic
DC-NSD and AC-NSD
PBI
available
available (with kit )                                   

For additional details please contact your sales team


Contact
Sales Team
sales@besi.com

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