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Datacon 8800 CHAMEO advanced

Highest Productivity for FO-WLP

As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control.

The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs.

Multi-Chip – Combining Speed, Flexibility and Accuracy

  • Multi-chip capability – Flexibility on smallest footprint
  • Single pass is king – Improve your Cpk for multi-FC packages
  • Waffle pack feeders – Extend your possibilities
  • Extra Speed up to +40%

Enhanced Capabilities – Ready for the Future

  • Thermo-compression – No limits for your applications
  • Leadframe, strip, boat, wafer – No limits for your substrates
  • Customized features – Exactly tailored for your process
  • 300 mm / 340 mm Fan Out Wafer Level Packages (FO-WLP) Carrier
  • Face-down & Face-up (recipe controlled)
  • Clean room class ISO 5
  • Foup load port
  • Tape & Reel

Highest Accuracy – Capturing Tomorrow’s Markets

  • Highest Accuracy ± 5 µm / 3 µm @ 3 Sigma – For fine-pitch and TSV applications
  • Local reflow – Mastering sophisticated assemblies
  • Long-term stability – Securing high yield at high speed

Wafer Level Applications

  • Fan-Out Wafer Level Packages – Highest performance for lowest cost
  • Advanced Chip to Wafer – Cost effective dual die stacking
  • Through Silicon Vias (TSV) – Entry ticket to the future

Local accuracy± 3 µm @ 3 sigma
Global accuracy± 5 µm @ 3 sigma
Vision system4 Mpix, 6 x 6 mm FOV
Strips, Boats, Panels340 mm
C2W12"
Fluxeroption
Multi Chipincluded
UPH (dipping process)6000
UPH (FO-WLP / no dipping)7000
Clean room classISO 5 (optionally)
Face-downincluded
Face-upoption
Tape & Reeloption
FOUP load portoption
Temperatureoption (constant)
Capability integrityenhanced standard
Pre-heat Stationoption
Local reflownot available
Lead time8-10 weeks

Besi Netherlands B.V.

Tel: +31 26 319 6100

sales@besi.com

Besi Switzerland AG

Tel: +41 41 749 5111

sales@besi.com

Besi Austria GmbH

Tel: +43 5337 6000

sales@besi.com

Meco Equipment Engineers B.V.

Tel: +31 416 384 384

sales@besi.com

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