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Datacon 8800 FC QUANTUM sigma

The Datacon 8800 FC QUANTUM sigma flip chip bonder represents the next generation of the high-volume, high-accuracy 8800 platform. Beside the factory-proven QUANTUM values it provides superior speed and accuracy while drastically improving your cost-of-ownership.

Enhanced Accuracy, Higher Speed – Unbeatable Cost-of-Ownership for Flip Chip

  • Exceptional accuracy of ± 5 µm @ 3 Sigma at highest speed
  • Increased, higher productivity, highest yield
  • Operator-independent quality by fully automatic machine calibration

High Flexibility – No Compromise for any Production Process

  • Capability to handle any flip chip size
  • No restriction on substrate type (leadframes, strips, panels, wafers up to 8")
  • Ready for ultra thin die handling

High Reliability – Consistent Quality, Minimal Risk

  • Field-proven, reliable machine concept and production process
  • Matching the requirements of IDMs and subcons (90% market share)
  • Unbeatable benchmark for flip chip assembly equipment

X/Y placement accuracy± 5 µm @ 3 sigma
Bond force200 g - 5,000 g (less wit Low Force Kit)
Die size0.4 mm – 30 mm
Die thickness0.02 mm – 7 mm
Wafer size4" – 12" (on 8" or 12" wafer frames)
Substrate typesFR4, ceramic, BGA, strip, flex, boat, leadframe
Working range13" x 12"
Flux film thicknessVarious cavity plates available
Size1,600 mm x 1,200 mm x 1,450 mm (W x D x H)
Weight2,000 kg

Substrate / Strip Handling

  • Input/output buffer
  • Magazine loader/unloader ML1
  • Vision system
  • RGB lighting
  • OCR recognition for substrates

Software

  • Wafer mapping host
  • Substrate mapping

Besi Netherlands B.V.

Tel: +31 26 319 6100

sales@besi.com

Besi Switzerland AG

Tel: +41 41 749 5111

sales@besi.com

Besi Austria GmbH

Tel: +43 5337 6000

sales@besi.com

Meco Equipment Engineers B.V.

Tel: +31 416 384 384

sales@besi.com

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