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Esec 2009 SSIE

The new Esec Die Bonder 2009 SSIE is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are unmatched in the industry. Thanks to the patented soft solder process technologies the Esec Die Bonder 2009 SSIE ensures your leading market position.

The 2009 SSIE is the only softsolder bonder in the market able to handle 300mm / 12" wafers (optional).

Highest Speed

  • New point to line pick & place
  • High speed high accuracy dispensing technology

Best Process Quality

  • Lowest gas consumption
  • Patented dispensing and bonding technology
  • Process visualization

Widest Application Range

  • Solution to handle the ultra thin and ultra wide leadframes
  • Solution to process power modules

Fastest Time to Yield

  • Fast product change over with exchangeable indexer
  • User friendly menu structure
  • Easy to use mechanical design

Co-Development

  • Involve in power package design
  • Work closely together with customers and suppliers

Ready for the Future

  • Expandable machine design
  • Multi process capability
  • Ultra thin die handling

Net productivity2,500 to 8,000 UPH typical
Typical bonding accuracy (product dependent)60µm @ 3σ
with optical bond centering option: 50µm @ 3σ
Solder wire spoolsDiameter: max. 155 mm / 6.1”
Width: max. 12 mm / 0.47”
Mounting hole: 8 mm to 10.5 mm / 0.31” to 0.41”
Wafer sizeUp to 8"
12" optional
Die size1 x 1 mm to 11 x 11 mm
40 x 40 mils to 430 x 430 mils
Machine dimensions1,970 x 1,305 x 1,760 mm (W x D x H)

Handling

  • Magazine Handler Input
  • Magazine Handler Output
  • Top Stack Loader Wide
  • Dual Input Handler
  • Dual Power Leadframe Loader
  • Dual Power Leadframe Loader 2
  • Stack Power
  • Power Marker Unit
  • Single Wafer Loader

Dispenser

  • Programmable Dual Wire Dispenser
  • Programmable Pre Press Module

Vision

  • Prog. Quality Control Television
  • Optical Bond Centering (OBC)
  • Pre-bond Vision Inspection (Pre-IQC)
  • Post-bond Vision Inspection (Post-IQC)

Miscellaneous Options / Special Applications

  • Advanced Thin Die
  • Thin Die Pick-up
  • Thin Die Pick-up Flexible
  • Small Die Kit / Ultra Small Die Kit
  • Leadframe Identification
  • Uninterruptible Power Supply
  • Heated Pepper Pot
  • Gas Supply Feature
  • Wafer Mapping Package (WMP4, incl. conversion package)
  • Host Package

  Esec2009SSIE .pdf

PDF - 507 K

  Esec2009fSESSIEPUM.pdf

PDF - 595 K

Besi Netherlands B.V.

Tel: +31 26 319 6100

sales@besi.com

Besi Switzerland AG

Tel: +41 41 749 5111

sales@besi.com

Besi Austria GmbH

Tel: +43 5337 6000

sales@besi.com

Meco Equipment Engineers B.V.

Tel: +31 416 384 384

sales@besi.com

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