Chemistry and Tooling
Meco complements its offering with all required process chemistry, hardware and accessories.
Mecodeflash 100 is a superior electrolytic process designed to loosen and remove the thin layer of mold bleed from plastic semiconductor packages.
Mecostrip Au 2 is specially designed for backstripping of goldflash in selective plating equipment.
Besi always researches new innovative technologies. Therefore we continuously participate in several EU projects to develop new products and new production technologies.