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Events & Shows

17 Apr 2024 - 20 Apr 2024

IMAPS International Conference on Electronics Packaging

Join our invited talk at the IMAPS ICEP in Toyama, Japan.

Join us at ICEP 2024, taking place from April 17 to 20, 2024, in Toyama, Japan.

ICEP stands as the largest international conference on electronic packaging in Japan, drawing over 360 attendees and offering approximately 35 technical sessions. As a premier platform, ICEP provides an ideal setting to showcase your technologies and products while expanding your customer network. Jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS, the conference covers a broad spectrum of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, and thermal management.

Don't miss this opportunity to engage with industry leaders, exchange insights, and explore the latest advancements in electronic packaging. See you at ICEP 2024!

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