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Events & Shows

23 Oct 2018 - 25 Oct 2018

IWLPC conference

On the IWLPC conference on October 23-25 in San Jose, California, USA, Besi will be presenting a paper: "Exposed die Fan-Out Wafer Level Packaging by transfer molding".

On the IWLPC conference on October 23-25 in San Jose, California, USA, Besi will be presenting a paper: "Exposed die Fan-Out Wafer Level Packaging by transfer molding".

www.iwlpc.com 

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