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Datacon 2200 evoplus

The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.
Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.

Datacon 2200 evo goes PLUS!

  • PLUS accuracy
  • PLUS productivity
  • PLUS flexibility
  • Multi-chip capability
  • Flexibility for customizing
  • Open platform architecture

Key Features

Integrated Dispenser

  • Pressure/time (Musashi®), Auger, Jetter types available
  • Epoxy stamping option
  • Filled and unfilled epoxy, wide viscosity range
  • Small footprint, low cost-of-ownership

Vision Alignment

  • New high-speed image processing unit
  • Full alignment & bad mark search
  • Pre-defined fiducial geometry & customized teaching

Automatic Wafer and Tool Changer

  • Fully automatic cycle for multi-chip production
  • Up to 7 pick & place tools (optionally 14), 5 eject tools
  • Stamping tools and calibration tools possible

Pick & Place Head

  • Die attach, flip chip and multi-chip in one machine
  • Die pick from: wafer, waffle pack, Gel-Pak®, feeder
  • Die place to: substrate, boat, carrier, PCB, leadframe, wafer
  • Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic

Specifications

Performance

  • X/Y placement accuracy: ± 7 µm @ 3s
  • Theta placement accuracy: ± 0.15° @ 3s

UPH

  • Die attach: up to 7,000 UPH/module
  • Flip Chip with dipping up to 2,500 UPH/module
  • Flip Chip without dipping up to 3,200 UPH/module

Bond Heads

  • Standard bond head 0° - 360° rotation
  • Heated bond head (optional)

Footprint

  • LxDxH: 1,160 mm x 1,225 mm x 1,800 mm

Statistics

  • Uptime > 98 %
  • Yield > 99.95 %

Wafer

  • Die size Die Attach: 0.17 mm - 50 mm
  • Die size Flip Chip: 0.5 mm - 50 mm
  • Die thickness: 0.05 mm - 7 mm
  • Wafer size: 2" - 12" (50 mm - 300 mm)
  • Frame size: 5" - 15" (125 mm - 375 mm)

Chip Trays

  • Waffle pack / Gel-Pak® 2” x 2” and  4” x 4”
  • JEDEC tray on request

Substrates and Carriers

  • FR4, ceramic, BGA, flex, boat, lead frame, waffle pack
  • Gel-Pak®, JEDEC tray, odd-shape substrates
  • Substrate working range: 13” x 8”(325 mm x 200 mm)

Options

  • Hardware: Open platform architecture for full customization
  • Software: Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition, and more.

Downloads

  Datacon2200evoplus.pdf

PDF - 364 KB

Besi Netherlands B.V.

Tel: +31 26 319 6100

sales@remove-mebesi.com

Besi Switzerland AG

Tel: +41 41 749 5111

sales@remove-mebesi.com

Besi Austria GmbH

Tel: +43 5337 6000

sales@remove-mebesi.com

Meco Equipment Engineers B.V.

Tel: +31 416 384 384

sales@remove-mebesi.com

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