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Datacon 8800 TC advanced

Thermo Compression bonding is the key technology for current 2.5D/3D C2S and C2W packaging, with TC-CUF as the currently established process for 3D memory applications.

The Datacon 8800 TC advanced sets the new benchmark based on the proven 8800 concept with total process control, advanced capabilities and unsurpassed production stability. With its unique and complete new Advanced Hardware architecture, unique 7-Axis Bond head and Advanced Process capabilities, the Datacon 8800 TC advanced is the essential tool of reference of current TSV applications.

The Datacon 8800 TC advanced:

  • Ultra Fine Pitch Capability
  • Enhanced Thermo Compression Bond Control
  • 7-Axis Bond Head
  • Highest Productivity on Smallest Footprint

Key Features

Next Generation Control Platform

  • New motion control - New hardware & software
  • Enhanced trajectory control - Reduced latency times
  • More computing power - Process variable tracing
        

7-Axis / 250N Bond Head

  • 3 Actuators for positioning - X, Y, Theta
  • 2 Axes for bond control - Z, W
  • 2 Actuators for auto tilt setup - A, B
      

Advanced TC-CUF Yield Control

  • Yield and down-time prevention caused by flux
  • Trajectory controlled heating and cooling
  • New thermal stress resistant tool holder - Tilt
  • Accurate temperature calibration station
      

Optimized Tool Holder & Tool Hardware

  • New tool holder design - Special improved electrical contact mechanism
  • Fast maintenance
  • New tool design - Improved heater temperature accuracy and optimized electrical contact material
       

Integrated Monitoring & Alarming

  • Alarm window setup for any process variable
  • Process variable monitoring against defined alarm window
  • Escaping alarm window generates machine stop and alarm
  • Monitoring results available via SECS/GEM
       

Temperature Calibration Station

  • Enhanced tool to tool repeatability
  • In-situ temperature check - 20 to 240 °C within ±1 °C
  • Portable sensor - Move from machine to machine
      

Tool to Tool Repeatability

  • Recipe portability
  • Separation of machine and recipe parameters
  • Auto calibration - Consistantly calibrated tools
  • Portable alarm windows
      

Specifications

Performance

X/Y placement accuracy± 2 µm @ 3 sigma
Accuracy self checkSingle BMC kit
Outputup to 1,000 UPH
Number of bond heads2
7-axis TC bond head4° - 4° rotation
Tool heatingup to 420 °C
Ramping speed+ 200 °C/s (Heating)
- 100 °C/s (Cooling)
Temperature uniformity± 5 °C
Interface temperature monitoringIntegrated measurement
Bond force3 - 250 N (full UPH)
Bond controlForce / Height / Both combined
Tool flatness± 1 µm
Co-planarity± 2 µm @ 10 mm
Co-planarity set-upAutomatic
Footprint1,600 x 1,200 x 1,880 mm
Uptime> 95%

 

Substrate & Carriers

C2S - Stripsmax. 260 x 125 mm
C2S - Boats/Carriersmax. 260 x 125 mm
C2W - Wafersmax. 12" (300 mm)
C2W - LoadingManual / FOUP on request (option)
Substrate heatingmax. 200 °C ± 2.5%

 

Components

Die size2 - 16 mm
Die thicknessmin. 50 µm (smaller dimensions on request)
Wafer size8" - 12" (200 - 300 mm)
Frame size9" - 15" (125 - 375 mm)

 

Multi-chip Capability

TeachingCamera view
Multi-chip modesStacked die or Side-by-side
Wafer changeAutomatic (up to 25 types per cassette)
Pick & Place tool changeManual
Ejector tool changeAutomatic (up to 3 sizes)
Bond profilesIndividual bond profiles per stack layer

 

Component Handling

Flip chip unitPick-up of the component from wafer, 180° rotation of the flip arm and presentation to the bond head
Wafer pre-rotation0° - 280°
Slide fluxerOptional
Cassettes1
Cassette sizeup to 25 film frames per cassette

 

Substrate Handling

Substrate & carrier transportGripper based with vacuum cups
Wafer transportRobot handling (from dual FOUP port on request)
I/O bufferFlat belt system, inline (SMEMA) or stand-alone possible
I/O Elevator typeProgrammable lift systems for one magazine
I/O Magazine sizeVarious (on request)

 

Flux Application (option)

Flux film thicknessCavity plates from 5 μm – 200 μm
Viscosity range2,800 cps – 110,000 cps

  

Tool system

Bond toolsIntegrated heater / cooler and temperature sensor
Single chip ejectorFor one configured ejector tool
Multi chip ejectorAutomatic quick changing carousel system, max. 3 ejector tools

   

Vision system

Field of ViewWafer camera: 12 x 12 mm 
Substrate camera: 2.0 x 1.6 mm
Up-looking camera: 2.0 x 1.6 mm
IlluminationProgrammable RGB lighting (4 different colors)
Image recognition methodsCircle search, edge search, bump search, feature matching, structure search, epoxy inspection, contour inspection, datamatrix recognition, ...

   

Computer and MMI system

Operating systemLinux
User interface (GUI)User-friendly graphical user interface with pull-down menus
Monitor2x 19" flat screen
Data storageHDD, USB
Data transferFTP via TCP/IP network, SECS/GEM
InterfaceSMEMA 1.2, SECS-II (GEM compliant)

 

Standard software

FeaturesPost -bond inspection, Z-positional bonding, Auto-calibration
Programming wizardsStep-by-step guided programming with graphical support for e.g. product, substrate, component, epoxy

  

Options

HardwareOpen platform architecture for full customization
Software

- Single component tracking
- CAD download
- Wafer mapping
- Substrate mapping
- Barcode scanner
- Data matrix recognition
- Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142) 
- Pseudo X-Ray 
- Flip and P&P Tool Inspection 
- Needle Hole Inspection 
- Eject Tool Needle Inspection 
- Eject Tool Cap Inspection 
- Ejection System Live Cam 
- SECS GEM Parameter Provider 
- Wafermap Verification by Border Component 
- Configure User Level 
- Advanced Flux Imprint Check 
- Chipping Inspection 
- Auto Illumination 
- Distributed Bonding 
- Single Component Tracking 
- Lot Management

and more

 

 

Besi Netherlands B.V.

Tel: +31 26 319 6100

sales@remove-mebesi.com

Besi Switzerland AG

Tel: +41 41 749 5111

sales@remove-mebesi.com

Besi Austria GmbH

Tel: +43 5337 6000

sales@remove-mebesi.com

Meco Equipment Engineers B.V.

Tel: +31 416 384 384

sales@remove-mebesi.com

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