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Esec 2100 sD advanced

The latest member of the field proven High-end Esec 2100 sD machine family is featuring the new 3rd Generation High Resolution Vision System, a completely redesigned clean unit as well as new easy to use GUI.The new Esec 2100 sDadvanced Die Bonder is able to handle the most challenging thin die and warped strip packages. The proven “light & rigid” structure of the Pick&Place ensures highest accuracy and maximized throughput. This fine piece of Esec High-end Equipment quarantees maximum flexibility and outstanding process capabilities meeting today’s and tomorrow’s requirements.

Next Generation Two in One Die Bonder
  • Two in one machine configuration. Single Pick & Place and additional parallel Pick & Place
  • Instant switching between single and parallel Pick & Place mode
  • New transfer table axis in parallel module with significant higher axis performance
  • Excellent standard die productivity
  • Superior ultra thin die productivity 

Key features

Speed & Accuracy

  • Superior “light & rigid” P&P design 
  • Voice coil drive X axis  Enhanced Z axis with integrated encoder 
  • High performance Y axis with optional Liquid Cooling System 
  • Advanced Real time Trajectory Controller 
  • High Accuracy Mode 
  • High Flow Bond Head 
      

New Generation Clean Kit

  • Air flow from front to back 
  • Programmable air flow from 3 to 12 qm 
  • Standby mode if no strip loaded 
  • ULPA filter available 
  • ISO class 4 (with clean speed) 
  • Additional anti contamination, remove dust and particles kit available 
      

3rd Generation Vision System

  • High resolution 4 mega pixel cameras 
  • Sharp image with 12.4 μm/pixel resolution 
  • Dual color illumination featuring red and white light 
  • Three light sources per camera (direct, indirect and vertical) 
  • High resolution enabling cracked die and defects detection 
      

Ease of Use

  • New 16:9 GUI 
  • Two inspection image display mode 
  • Display of inspection image and statistic or inspection image and wafer map at the same time 
  • Graphical status overview of vacuum, air pressure temperture for all purposes 
      

Specifications

Die Placement Accuracy & Productivity

  • DAF, in Standard Mode: 15 μm / 0.15° @ 3 σ* / dry cycle 232 ms
  • DAF, in High Accuracy Mode:  10 μm / 0.15° @3 σ* / dry cycle 256 ms
  • DAF, in Parallel Mode:  8 μm / 0.12° @3 σ** / dry cycle 396 ms

    * with die size > 2 x 2 mm ** with die size > 3 x 3 mm
      

Process

  • Bond Force: 0.2 - 50 N 
  • Bond Rotation: 360° Programmable 
  • Pre-bond/bond/post-bond heating: programmable, max. 200 °C 
      

Substrates

  • Length: 120 mm - 300 mm 
  • Width: 15 - 125 mm 
  • Thickness: 0.1 - 2.5 mm 
      

Wafer and Die Dimensions

  • Wafer Size: Up to 12” 
  • Die Size: 0.5 x 0.5 mm - 20 x 20 mm / 20 x 20 mils - 800 x 800 mils

Machine Dimensions

  • Footprint W x D x H: 1785x 1448x 1400 mm 
  • Weight: 1600 kg / 3500 lb
      

Options

Substrate Handler

  • Dual Input (MHIN and TOS)
  • Magazine Handler Input (MHIN only)
  • Raildownholder
  • Motorized Downholder Disp/Bond
  • Strip Marking Unit
  • Strip Thickness Compensation
  • Strip Handler 125mm hot Flat with magnetic Y-Push-In
  • Strip Handler 125mm hot taped QFN
  • Strip Handler 125mm hot Stage-Z
  • Substrate Blow-Off Kit
  • Roll-Out Slippage Check
  • Controlled Y-Axis Roll-Out
  • SMEMA Link Input
  • SMEMA Link Output
  • Pick Strip from Box
      

Dispenser

  • PDS Epoxy Level Detection
  • PDS Purge and Pre-Dispense Station 
      

Pick & Place

  • Fusion Bond Process
  • Massflow Die Sensor
  • Small Die Kit
  • Parallel Pick & Place Unit
  • Uplooking Setup Camera
  • Liquid Cooling System 
       

Die Ejector

  • Ultra Thin Die Needle Module
  • Ultra Thin Die Multidisc Module
      

Vision

  • Dispense Indirect Illumination 2 colors
  • Bond Indirect Illumination 2 colors
  • Dispense Vertical Indirect Illumination
  • Bond Vertical Indirect Illumination
  • Dispense Quality Check
  • Bond Quality Check
      

Automation

  • Wafer Mapping inclusive Conversion
  • Host Communication Interface
  • E142 Strip Mapping
      

Miscellaneous

  • Uninterruptible Power Supply to PC
  • Ionizer-Controlled Pick
  • Ionizer-Controlled Bond
  • Ionizer-Controlled Dispense
  • Ionizer-Controlled WH Load Top
  • Ionizer-Controlled WH Load Bottom
  • Ionizer-Controlled Magazine Input
  • Ionizer-Controlled Transfer Table
  • Clean Machine Environment Kit
  • Air Particle Sensor
  • Strip Cleaning Unit
  • Particle Removal Kit
      

Downloads

Besi Netherlands B.V.

Tel: +31 26 319 6100

sales@remove-mebesi.com

Besi Switzerland AG

Tel: +41 41 749 5111

sales@remove-mebesi.com

Besi Austria GmbH

Tel: +43 5337 6000

sales@remove-mebesi.com

Meco Equipment Engineers B.V.

Tel: +31 416 384 384

sales@remove-mebesi.com

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