Besi offers a wide range of die attach systems based on leading-edge technology. The offering includes multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders for mass production, stacked die bonders and die sorting equipment. Besi leads the way in the die attach market, guaranteeing customers future-oriented, customized and flexible solution.
As one of the leaders in die attach for more than two decades, Besi is committed to surpassing its customers' needs by constantly setting new industry standards in die attach. Its die attach platforms constantly demonstrate the company's innovation strength and set already today the future industry standards. Besi's die sorting equipment incorporate advanced technologies and cover a wide variety of processes.
Besi always researches new innovative technologies. Therefore we continuously participate in several EU projects to develop new products and new production technologies.