Welcome to the world of Besi
BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy.
Publications
Semiconductor Equipment
Datacon 2200 evo advancedMore information
Datacon 8800 FC QUANTUM advancedMore information
Datacon 2200 evo plusMore information
Datacon 8800 CHAMEO advancedMore information
Datacon 2200 evoMore information
Datacon 8800 TC advancedMore information
Datacon 2200 evo hSMore information
Esec 2100 sD advanced iMore information
Esec 2100 hSiMore information
Esec 2100 SCMore information
Esec 2100 hSMore information
Esec 2009 SSIEMore information
Esec 2100 sDplusMore information
Esec 2100 sD PPPplusMore information
Esec 2009 fSEMore information
Esec 2100 FC hSMore information
Esec 2100 DSMore information
Fico Molding LineMore information
Fico Compact Line - PMore information
Fico Sawing LineMore information
Fico AMS-WMore information
Fico MMS-LMMore information
Fico AMS-W Top FoilMore information
Fico AMS-iMore information
Fico Laser MarkerMore information
Fico AMS-LMMore information
Fico Compact Line - XMore information
Fico MMS-LM Top FoilMore information
Fico AMS-LM Top FoilMore information
Fico MMS-iMore information
Fico Compact LineMore information
Meco ACPMore information
Meco RTR AgMore information
Meco EDF/EPLMore information
Meco Connector PlatingMore information
Meco DPLMore information
Meco PPLMore information
Meco RTR SolarMore information
Meco CPLMore information
Meco FAPMore information