Products & Services
Besi supplies leading edge systems offering increased productivity, improved yields of defect-free devices and a low cost of ownership. Besi offers customers a broad portfolio of systems which address substantially all the assembly process steps involved in leadframe, substrate and wafer level packaging. Besi's principal product offerings include:
Die Attach Equipment
Besi produces single chip, multi chip, multi module and flip chip die bonding systems and die sorting systems.
Besi produces molding, trim & form and singulation systems.
Besi produces tin, copper and precious metal plating systems.
Besi provides tooling, conversion kits and spare parts to its installed base of customers worldwide.