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Products & Services

Besi supplies leading edge systems offering increased productivity, improved yields of defect-free devices and a low cost of ownership. Besi offers customers a broad portfolio of systems which address substantially all the assembly process steps involved in leadframe, substrate and wafer level packaging. Besi's principal product offerings include:

Die Attach Equipment

Besi produces single chip, multi chip, multi module and flip chip die bonding systems and die sorting systems.

Packaging Equipment

Besi produces molding, trim & form and singulation systems.

Plating Equipment

Besi produces tin, copper and precious metal plating systems.


Besi provides tooling, conversion kits and spare parts to its installed base of customers worldwide.

Contact Us

BE Semiconductor Industries N.V.

Tel: +31 26 319 4500

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