Products & Services
Besi is a leading manufacturer of assembly equipment supplying a broad portfolio of advanced packaging solutions to the semiconductor and electronics industries. Besi offers customers high levels of accuracy, reliability and throughput at a low cost of ownership in each of leadframe, substrate and wafer level assembly. Our principal product and service offerings are set forth below:
Die Attach Equipment
Single chip, multi chip, multi module, flip chip, thermal compression bonding ("TCB"), fan out wafer level packaging ("FOWLP"), hybrid and embedded bridge die bonding systems and die sorting systems.
Conventional, ultra thin and wafer level molding, trim & form and singulation systems.
Tin, copper, precious metal and solar plating systems and related process chemicals.
Tooling, conversion kits and spare parts and other services for its installed base of customers.