StockTicker
Navigatie is gesloten

Esec 2100 sD advanced i

The new Esec 2100 sD advanced i with its new Device Height Sensor and High Precision Bond Head enables unmatched process capability also including High BLT applications.

Process Accuracy is further improved with the High Resolution Vision Systems, which now also includes an Up Looking System while the Dual Dispensing Module brings productivity to an unmatched level for high speed applications.

The Dispense Volume Control and the Low Contrast Kit bring Process Control to a yet unseen level.

Last but not least, the Esec 2100 sD advanced i introduces auto-optimizing tool offsets and dispense pressure after syringe change.

Key Features

Intelligence in Accuracy

  • Device Height Sensor for extreme Z-Height Control
  • High Precision Bond Head with highly accurate Theta-axis
  • High accuracy closed loop P&P Z-axis
  • High Resolution 4 Megapixel Vision Systems
  • New High Resolution Up Looking Vision System
  • High Accuracy Production Modes
        

Intelligence in Process Control

  • Low Contrast Object detection vision capability
  • Three Dual Color Light Sources per camera
  • Full High Definition (FHD) Graphical User Interface with multiple camera inspection images and Viewers
  • Sensor status overview of vacuum, air pressure and temperatures.
        

Intelligence in Productivity

  • Dual Dispensing Module with independent writing axes
  • Dual 5 bar Pneumatic Dispense System Controller
  • Superior and proven “light & rigid” P&P design
  • High Performance P&P Y-axis with Liquid Cooling System
  • High Performance 4th Generation Vision System
  • High Speed Production Mode with excellent accuracy
        

Intelligence in Automation

  • Automated Bond Head Tilt Adjustment
  • Auto Adjusting Pick Up Tool and Capillary offsets
  • Auto Adjusting Dispense Pressure after syringe change
  • Constant dispensing with Dispense Volume Control
  • Auto Position Adjustment of Die and Epoxy Placements
  • Automatic Illumination Detection (vertical, indirect lights)
        

Specifications

Die Placement Accuracy (DAF)

  • >2 mm: 15 μm / 0.15° (3σ) (high speed mode)
  • >2 mm: 10 μm / 0.15° (3σ) (accuracy mode)
  • >2 mm: 8 μm / 0.12° (3σ) (up looking vision)
  • MTBF: > 200 h
       

Die Placement Accuracy (Epoxy)

  • >2 mm: 18 μm / 0.2° (3σ) (high speed mode)
  • >2 mm: 12 μm / 0.2° (3σ) (accuracy mode)
  • >2 mm: 10 μm / 0.15° (3σ) (up looking vision)
  • MTBF: > 200 h
         

Bond Process

  • Bond force: 0.2 - 50 N
  • Bond rotation: 360°
  • Pre-bond/bond/post-bond heating: programmable, max. 200°C
       

Substrate Dimensions

  • Width: 15 - 125 mm
  • Length: 90 - 300 mm
  • Thickness: 0.1 - 2.5 mm 
       

Wafer and Die Dimensions

  • Wafer size: 4” - 12”
  • Frame size: 8” - 12”
  • Die size: 0.5 - 20 mm
  • Die thickness: > 0.075 mm
       

Machine Dimensions

  • Footprint: W x D x H: 1785 x 1448 x 1400 mm
  • Weight: approx. 1600 kg / 3500 lb
        

Options

Substrate Handler

  • Dual Input (MHIN and TOS)
  • Magazine Handler Input (MHIN only)
  • Raildownholder
  • Motorized Downholder Disp/Bond
  • Strip Marking Unit
  • Strip Thickness Compensation
  • Strip Handler 125 mm hot Flat with magnetic Y-Push-In
  • Strip Handler 125 mm hot taped QFN
  • Strip Handler 125 mm hot Stage-Z
  • Substrate Blow-Off Kit
  • Roll-Out Slippage Check
  • Controlled Y-Axis Roll-Out
  • SMEMA Link Input
  • SMEMA Link Output
  • Pick Strip from Box
       

Pick & Place 

  • Massflow Die Sensor
  • Liquid Cooling System
  • Fusion Bonding
  • Parallel Pick and Place 2
       

Die Ejector – Process Modules

  • Ultra Thin Die Needle
  • Ultra Thin Die Multidisc
  • Ultra Thin Die Needle and Multidisc
        

Vision 

  • Dual Dispense Indirect Illumination 2 colors
  • Bond Indirect Illumination 2 colors
  • Dispense Vertical Indirect Illumination 2 colors
  • Bond Vertical Indirect Illumination 2 colors
  • Uplooking Vision 
       

Automation 

  • Wafer Mapping inclusive Conversion
  • Host Communication Interface
  • E142 Strip Mapping
       

Miscellaneous 

  • Uninterruptible Power Supply to PC
  • Ionizer-Controlled Pick
  • Ionizer-Controlled Bond
  • Ionizer-Controlled Dispense
  • Ionizer-Controlled WH Load Top
  • Ionizer-Controlled WH Load Bottom
  • Ionizer-Controlled Magazine Input
  • Ionizer-Controlled Transfer Table
  • Air Particle Sensor
  • Clean Machine Environment Kit
  • Strip Cleaning Unit
  • Particle Removal Kit (Pick, Disp, Bond)
        

Besi Netherlands B.V.

Tel: +31 26 319 6100

sales@remove-mebesi.com

Besi Switzerland AG

Tel: +41 41 749 5111

sales@remove-mebesi.com

Besi Austria GmbH

Tel: +43 5337 6000

sales@remove-mebesi.com

Meco Equipment Engineers B.V.

Tel: +31 416 384 384

sales@remove-mebesi.com

Back To Top