Soft Solder Die Bonding
Besi Switzerland is a globally leading designer and supplier of fully automated soft solder die attach equipment for the power semiconductor mass market. Its more than 30 years of experience and broad base of installed soft solder systems make Besi Switzerland a valuable partner for your current and future power applications.
Today’s power devices used in communications, automotive, computers, home appliances and handheld devices have entered a new era of miniaturisation. This development requires more power dissipation in small packages and asks for a more stringent process control. Besi Switzerland is teaming up with key customers and major material suppliers to forge an optimum power packaging solution. Our patented Soft Solder Process Technologies ensure our customers leading position.
Esec 2100 DS, the flexible and fast high temperature Die Bonding Platform for Leadframe Applications.
The new Esec 2009 SSIE die bonder is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are unmatched in the industry.