Besi EU projects
The European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-In-Package (EuroPAT-MASIP) project will reinforce the European semiconductor manufacturing position through focusing in the Integrated Circuit and MEMS packaging ecosystem.
The goal of the project is to accelerate the manufacturing uptake of advanced packaging technologies and shorten time-to-market by demonstrating the new capabilities in need-based Application Pilots
Lab4MEMS II focuses on Micro-Opto-Electro-Mechanical Systems (MOEMS) that merge MEMS with Micro-optics to sense or manipulate optical signals using integrated mechanical, optical, and electrical systems, while the original project maintains its emphasis on developing a pilot line for next-generation MEMS devices augmented with such advanced technologies as piezoelectric or magnetic materials and 3D packaging.
PowerBase, an ECSEL project with 39 partners from 9 European countries, enables growth potential and strategic independence for Europe´s semiconductor industry in the face of increased globalization.
ATHENIS_3D is an FP7/European funded project, where eleven partners from five different countries develop a new technology platform for automotive electronics. With this innovative IC platform electronic engineers will be able to integrate more functionality on a single chip for lower costs. This is possible through a new technology which enables further integration of advanced More than Moore devices and More Moore devices (90nm and 14nm CMOS) with Through Silicon Vias (TSV) and Wafer Level Packaging (WLP) for harshest automotive conditions including temperatures up to 200C and voltages up to 200V. Cost savings from integration and a 5x reduction of PCB area will be shown.
R2POWER300 is committed to challenge the development and manufacturing of a multi-KET Pilot Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing and Energy Efficiency and CO2 Reduction megatrends.
In the InForMed project an integrated pilot line for medical devices is established, covering the complete innovation chain from technology concept to system qualification. It includes micro-fabrication, assembly and even the fabrication of smart catheters. Uniquely, the integrated pilot line is hosted by a large industrial end-user, and is specifically targeted and equipped to bridge the gap in the landscape of micro-fabrication of medical devices between concept creation and full-scale production.
EAST (smart Everything everywhere Access to content through Small cells Technologies) develops enablers for 5G Small cells mobile networks up to 6 GHz. Key targets are enhanced data rates (video bandwidths > 100MHz), higher integration (10x to 100x size reduction), higher functionality (MIMO) and reconfigurability (multiple-transmit bands). Major steps have to be taken at the system/design level (novel transmitter architectures) and at the technology level (new silicon processes and packaging solutions). The outcome of this project will position Europe as a technology leader in the upcoming 5G market.
Energy efficiency and sustainability are major concerns in society today. The lighting industry is going through a radical transformation driven by rapid progress in LED lighting, semiconductor technology, and the need for sustainable and energy-efficient solutions. The EnLight project delivers new technology and applications that inspire and enable designers in ways far beyond conventional lighting.