In back-end semiconductor manufacturing, the die attach process is a critical step. At first glance, die attach seems to be a simple process step in the semiconductor manufacturing chain. However, the continuously increasing requirements of today's applications set high standards in die bonding. Besi’s die attach equipment is based on unique and innovative concepts offering economical benefits to customers.
The new Esec 2100 sD advanced i with its new Device Height Sensor and High Precision Bond Head enables unmatched process capability also including High BLT applications.
The new Esec 2100 hSi with its new Dual Dispensing Module enables an unmatched productivity and process quality.
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications.
The Die Bonder Esec 2100 SC is the most flexible 300 mm high speed platform, capable of running the smart card tape.
Besi Netherlands B.V.
Tel: +31 26 319 6100
Besi Switzerland AG
Tel: +41 41 749 5111
Besi Austria GmbH
Tel: +43 5337 6000
Meco Equipment Engineers B.V.
Tel: +31 416 384 384