In back-end semiconductor manufacturing, the die attach process is a critical step. At first glance, die attach seems to be a simple process step in the semiconductor manufacturing chain. However, the continuously increasing requirements of today's applications set high standards in die bonding. Besi’s die attach equipment is based on unique and innovative concepts offering economical benefits to customers.
The Die Bonder Esec 2100 SC is the most flexible 300 mm high speed platform, capable of running the smart card tape.
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications.
The new Esec 2100 hSi with its new Dual Dispensing Module enables an unmatched productivity and process quality.
The Esec 2100 sDplus, the 2nd generation of the proven Die Bonding Family, offers a wide range of benefits with the sole target of producing highest quality at lowest cost per die placement.
The Esec 2100 sD PPPplus is the only real Two-in-One Die Bonder on the market. Instant switching between parallel and standard production mode guarantees the highest quality at the lowest cost per die placement.
The new Esec 2100 sD advanced i with its new Device Height Sensor and High Precision Bond Head enables unmatched process capability also including High BLT applications.
As the first in the industry, Besi Switzerland introduces the Z-Pattern© for small die bonding in the range of 0.8 - 1.5 mm, achieving unbeatable UPH rates.