Accuracy

• ± 3µm @ 3s placement accuracy
• ± 0.07° @ 3s rotational accuracy
• New vision, optics and camera system
• Various configurable (FOV & resolution) set of cameras
• 3D & contactless height measurement options
   

Multi-chip

• Max. 14 different pick up tools / nozzles
• 5 eject tools
• 3 different epoxies / adhesive in a single pass
• Any flip chip / face up die combination
• Dual module for even higher productivity (option)
    

Bonding

• 0.05 - 25N closed loop bond-force
• 0-360° bond rotation
• Heated bond head (max. 450°C) (option)
• UV curing with up to 2,000mW/cm² (365 / 405nm) (option)
    

Dispensing

• High-end auger pump
• Time pressure dispensing
• Piezo jetter valves
• Pin transfer
• Auto epoxy volume control
    

Performance

• X/Y placement accuracy: ± 3 µm @ 3s
• Theta placement accuracy: ± 0.07° @ 3s
• Bond Force: 0.5N to 25N programmable
   

UPH

• Die attach: up to 7,000 UPH/module
• Flip Chip with dipping: up to 2,500 UPH/module
• Flip Chip without dipping: up to 3,200 UPH/module
   

Bond Heads

• Standard bond head 0° - 360° rotation
• Heated bond head up to 450°C (optional)
• UV Curing (365 nm & 405 nm)
   

Machine Dimensions

• LxDxH: 1,160 mm x 1,225 mm x 1,750 mm
• Weight: 1,300 kg
   

Statistics

• Uptime > 98 %
• Yield > 99.95 %
   

Wafer

• Die size Die Attach: 0.15 mm - 30 mm
• Die size Flip Chip: 0.5 mm - 30 mm
• Die thickness: >50 µm (thinner on request)
• Wafer size: 4" - 12" (SEMI M1)
• Frame size: FF070, FF105, FF108, FF123; automatic change (others on request)
   

Chip Trays

• Waffle pack / Gel-Pak® 2” x 2” and  4” x 4”
• JEDEC tray on request
   

Substrates and Carriers

• FR4, ceramic, BGA, flex, boat, lead frame, waffle pack
• Gel-Pak®, JEDEC tray, odd-shape substrates
• Substrate working range: 13” x 8” (325 mm x 200 mm)
   

Options

• Hardware: Open platform architecture for full customization
• Software: Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition and more