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Datacon 2200 evo advanced

Accuracy & Flexibility for your mass production

The new Datacon 2200 evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of Besi.With an all new gantry & controller system as well as a completely new vision and camera generation Datacon 2200 evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and throughput requirements.

While significantly increasing the accuracy and placement capabilities the Datacon 2200 evo advanced does not forget its roots in the Multi Module Attach family. It is still offering the unbeaten flexibility as well as the full customization capability that the Datacon 2200 evo platform is so well known for.

Key Features

Accuracy

  • ± 3µm @ 3s placement accuracy
  • ± 0.07° @ 3s rotational accuracy
  • New vision, optics and camera system
  • Various configurable (FOV & resolution) set of cameras
  • 3D & contactless height measurement options
     

Multi-chip

  • Max. 14 different pick up tools / nozzles
  • 5 eject tools
  • 3 different epoxies / adhesive in a single pass
  • Any flip chip / face up die combination
  • Dual module for even higher productivity (option)
      

Bonding

  • 0.05 - 25N closed loop bond-force
  • 0-360° bond rotation
  • Heated bond head (max. 450°C) (option)
  • UV curing with up to 2,000mW/cm2 (365 / 405nm) (option)
      

Dispensing

  • High-end auger pump
  • Time pressure dispensing
  • Piezo jetter valves
  • Pin transfer
  • Auto epoxy volume control
      

Specifications

Die Placement Accuracy

X/Y placement accuracy ±3 µm @ 3s
Theta placement accuracy± 0.07° @ 3s

 

Bond Head options

Temperature450°C
CuringUV curing (365 & 405nm)

 

Bond force

Force50 - 2,500g (closed loop)

 

Range of Wafer and Die Dimensions

Wafer size4" - 12" (SEMI M1)
Frame sizeFF105, FF108, FF123; automatic change
FF070 manual change
(others on request)
Die size0.15 - 30mm (aspect ratio <1:10, others on request)
Die thickness≥ 50µm, thinner on request

 

Options

HardwareOpen platform architecture for full customization
SoftwareSingle component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition and more

 

Dimensions

Footprint1,785 x 1,448 x 1,400mm (WxDxH)
Weight1,400kg / 3,000lb

 

 

Contact

Contact form

Besi Netherlands B.V.

Tel: +31 26 319 6100

Besi Switzerland AG

Tel: +41 41 749 5111

Besi Austria GmbH

Tel: +43 5337 6000

Meco Equipment Engineers B.V.

Tel: +31 416 384 384

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