Esec 2009 fSE
The Esec 2009 fSE is the fastest soft solder die bonder in the industry with a broad application range. First to mention the point-to-line pick & place with stationary indexer, which enables increased throughput and productivity.
- High throughput up to 8,000 UPH
- Best-in-class process control
- High speed point-to-line pick & place
- High speed X-shuttle
Extended Application Range
- Wide range of SOT, TO and DPAK packages
- Single row and matrix leadframes
- Dual die capability
- Flying header / fullpack
- Leadframe conversioh kits
- Full range 8" wafer capability
Fastest Time to Yield
- Fast and easy setup
- Auto teach function
- Process visualisation
- Solder pattern technology
- Superior service & process support
Low Operating Costs
- Maximum reduction of material cost
- Lowest gas consumption
Fastest Soft Solder Die Bonder With a Wide Application Range
The ever more demanding market requirements lead to the evolution of the Esec Die Bonder 2009 fSE, the fastest soft solder die bonder in the industry with a broad application range. First to mention the point-to-line pick & place with stationary indexer, which enables increased throughput and productivity. Furthermore, the Esec Die Bonder 2009 fSE handles both, single row and matrix leadframes as well as a wide variety of applications like SOT-23, SOT-223, SOT-89, TO-92, TO-126, TO-220 or DPAK devices. The optional leadframe conversion kits offer an effective solution for future changes in the product mix.
Besi Switzerland, as the industry leader in soft solder die bonding, stands for excellent process technology and equipment performance at lowest cost of ownership.
One typical example for lowest cost of ownership is the significantly lower gas consumption of up to 50 percent relative to competing systems, which means massive savings in operating costs every day.