Key Features

High Performance at High Accuracy

• Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request)
• High productivity, low cost-of-ownership
• Up to 4 working heads in one machine
  
  

Multi-Chip Capability

• Single pass production for complex products
• Die attach, flip chip, multi-chip in one machine
• Epoxy writing & stamping, flux dipping
  
  

Unbeaten Flexibility

• Die pick from wafer, waffle pack, gel pack, feeder
• Die place to carrier, boat, substrate, PCB, lead frame, wafer
• Hot and cold processes supported: epoxy, soldering, thermo-compression
• MCM, SiP, Hybrids
  
  

Open Platform Architecture for Full Customization

• Most advanced modular platform concept
• Production line tailored 100% to your needs
• Ideal solution with smallest footprint possible

Specifications

Machine Capability

X/Y placement accuracy	±10 µm @ 3 sigma (7 µm on request)
Heated bond head (optional)	Up to 350 °C
Bond force	0 – 7,500 g (programmable)

 

Wafer

Die size	Die attach 0.17 mm – 50 mm Flip Chip 0.8 mm – 50 mm
Die thickness	0.02 mm – 7 mm
Wafer size	4" – 12"

 

Tape and Reel

Tape width	8 mm – 44 mm

 

Substrates and Carriers

Types	FR4, ceramic, BGA, flex, boat, lead frame, waffle pack, Gel-Pak®, JEDEC tray
Working range	13" x 8"

 

Dispenser

Types	Pressure/time, Volumetric (Auger-screw type), High-performance D-style pump

 

Adhesive and Stamping Reservoir

Epoxy thickness	Setting range 0.1 mm – 5 mm (0.004" – 0.19")

 

Slide Fluxer

Flux film thickness	Various cavity plates available

 

Size and Weight*

Size	W 1,200 mm x D 1,225 mm x H 2,000 mm
Weight	1,300 kg

*single module without input/output systems