Datacon 2200 evo
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.
Key Features
High Performance at High Accuracy
- Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request)
- High productivity, low cost-of-ownership
- Up to 4 working heads in one machine
Multi-Chip Capability
- Single pass production for complex products
- Die attach, flip chip, multi-chip in one machine
- Epoxy writing & stamping, flux dipping
Unbeaten Flexibility
- Die pick from wafer, waffle pack, gel pack, feeder
- Die place to carrier, boat, substrate, PCB, lead frame, wafer
- Hot and cold processes supported: epoxy, soldering, thermo-compression
- MCM, SiP, Hybrids
Open Platform Architecture for Full Customization
- Most advanced modular platform concept
- Production line tailored 100% to your needs
- Ideal solution with smallest footprint possible
Specifications
Machine Capability
| X/Y placement accuracy | ±10 µm @ 3 sigma (7 µm on request) |
|---|---|
| Heated bond head (optional) | Up to 350 °C |
| Bond force | 0 – 7,500 g (programmable) |
Wafer
| Die size | Die attach 0.17 mm – 50 mm Flip Chip 0.8 mm – 50 mm |
|---|---|
| Die thickness | 0.02 mm – 7 mm |
| Wafer size | 4" – 12" |
Tape and Reel
| Tape width | 8 mm – 44 mm |
|---|
Substrates and Carriers
| Types | FR4, ceramic, BGA, flex, boat, lead frame, waffle pack, Gel-Pak®, JEDEC tray |
|---|---|
| Working range | 13" x 8" |
Dispenser
| Types | Pressure/time, Volumetric (Auger-screw type), High-performance D-style pump |
|---|
Adhesive and Stamping Reservoir
| Epoxy thickness | Setting range 0.1 mm – 5 mm (0.004" – 0.19") |
|---|
Slide Fluxer
| Flux film thickness | Various cavity plates available |
|---|
Size and Weight*
| Size | W 1,200 mm x D 1,225 mm x H 2,000 mm |
|---|---|
| Weight | 1,300 kg |
*single module without input/output systems
Contact
Besi Netherlands B.V.
Tel: +31 26 319 6100
Besi Switzerland AG
Tel: +41 41 749 5111
Besi Austria GmbH
Tel: +43 5337 6000
Meco Equipment Engineers B.V.
Tel: +31 416 384 384