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Datacon 2200 evo hS

Innovative Solution for Innovative Products

The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.

Datacon 2200 evo goes hS!

  • Multi-chip capability
  • Flexibility for customizing
  • Open platform architecture

Key Features

Multi-chip

  • Fully automatic cycle for Multi-chip production
  • Up to 7 Pick & Place tools (optionally 14), 5 eject tools
  • Pressure/time (Musashi®), Auger, Jetter type dispensers available
  • Epoxy stamping option
  • Filled and unfilled epoxy, wide viscosity range
      

Accuracy

  • New high-speed image processing unit
  • Full alignment & Bad mark search
  • Pre-defined fiducial geometry & customized teaching
      

Pick & Place Head

  • Die Attach, Flip Chip and Multi-Chip in one machine
  • Die pick from: wafer, waffle pack, Gel-Pak®, feeder
  • Die place to: substrate, boat, carrier, PCB, leadframe, wafer
  • Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic

Specifications

Accuracy

X/Y placement accuracy ±7 µm @ 3 sigma
Theta placement accuracy± 0.15° @ 3s

 

Bond Heads

Standard bond head0° - 360° rotation
Heated bond headoption

 

Dimensions

Footprint1,160 x 1,225 x 1,800 mm (WxDxH)
Weight1,450 kg

 

Performance

Uptime > 98%
Yield> 99.95%
Outputup to 12,000 UPH

 

Wafer

Die sizeDie attach 0.17 - 5 mm
Die thickness0.05 - 2 mm
Wafer size2 - 12" (50 - 300 mm)
Frame size5 - 15" (125 - 375 mm)

 

Chip trays

Waffle pack / Gel pack2 x 2" and 4 x 4"
JedecOn request

 

Substrate & Carriers

TypesFR4, ceramic, BGA, flex, boat, lead frame, waffle pack, Gel-Pak®, JEDEC tray, odd-shape substrates
Working range13 x 8" (325 x 200 mm)

 

Options

HardwareOpen platform architecture for full customization
SoftwareSingle component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition and more

 

 

Downloads

Contact

Contact form

Besi Netherlands B.V.

Tel: +31 26 319 6100

Besi Switzerland AG

Tel: +41 41 749 5111

Besi Austria GmbH

Tel: +43 5337 6000

Meco Equipment Engineers B.V.

Tel: +31 416 384 384

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