The use of leadless packages grows rapidly due to increasing component density. QFN/DFN packages have the disadvantage that the solder connection can only be inspected using x-ray processes, rather than Automated Optical Inspection (AOI). For the Automotive industry the AOI option is essential.
Besi introduces together with chemical partner Sytron a complete solution to ensure AOI is possible for QFN/DFN packages.
Immersion Tin plating (autocatalytic process) on full QFN/DFN Cu surface.
100% solderability pass after 16hr dry bake.
100% solderability pass after 8hr steam aging.
No exposed Cu areas.
Handling of Tape Ring with singulated QFN / DFN packages (8” / 10” / 12”).
20 Tape Rings per hour.
Excellent solderability on full Cu surface
|16 hours bake @ 150oC||8 hours steam aging|
Meco has written a whitepaper with more information about Wettable Flank. Download it below.
Meco has a full solution for your wettable flank products, with the new Meco WFL-20. The Meco WFL-20 is the highly advanced solution for your wettable flank surface mount. Download the product flyer below.
Meco Equipment Engineers B.V.
Tel: +31 416 384 384
P.O. Box 244
5150 AE Drunen
5151 DR Drunen