Total solution for QFN / DFN Side-Wettable Flanks
The use of leadless packages grows rapidly due to increasing component density. QFN/DFN packages have the disadvantage that the solder connection can only be inspected using x-ray processes, rather than Automated Optical Inspection (AOI). For the Automotive industry the AOI option is essential.
Besi introduces together with chemical partner Sytron a complete solution to ensure AOI is possible for QFN/DFN packages.
Processing ensures:
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Immersion Tin plating (autocatalytic process) on full QFN/DFN Cu surface.
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100% solderability pass after 16hr dry bake.
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100% solderability pass after 8hr steam aging.
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No exposed Cu areas.
Equipment:
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Handling of Tape Ring with singulated QFN / DFN packages (8” / 10” / 12”).
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20 Tape Rings per hour.
Excellent solderability on full Cu surface |
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| 16 hours bake @ 150oC | 8 hours steam aging |
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Whitepaper Wettable Flank
Meco has written a whitepaper with more information about Wettable Flank. Download it below.
Meco Wettable Flank Plating
Meco has a full solution for your wettable flank products, with the new Meco WFL-20. The Meco WFL-20 is the highly advanced solution for your wettable flank surface mount. Download the product flyer below.
Meco Equipment Engineers B.V.
Tel: +31 416 384 384
Het Sterrenbeeld 24
5215 ML 's-Hertogenbosch
The Netherlands