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Datacon 8800 FC QUANTUM advanced

As mass reflow Flip Chip becomes dominant in IC packaging, Besi again sets the benchmark for speed and productivity with its new Datacon 8800 FC QUANTUM advanced. The state of the art motion control, unique CRYSTAL - glass based fluxer - concept and enhanced computing power showcases the fastest and most cost effective Flip Chip system available today.

  • Highest UPH up to 9000, including dip fluxing
  • Full process and yield control
  • Proven 5µm accuracy

Key Features

Unprecedented Speed

  • Unique patent pending CRYSTAL concept (glass based fluxer with simultaneous inspection) 
  • Enhanced trajectories and motion control
  • Highest speed with full process control 

Full Yield Control

  • Full Process & Production control
  • Superior usability with enhanced Pseudo X-Ray
  • Fast Post Bond Inspection

Proven production Accuracy

  • 5µm accuracy at highest speed
  • Lowest vibration with SMART path filtering
  • Enhanced Matrix BMC test

Shortest Lead time

  • 4 Weeks lead time
  • Lean production process
  • Aligned with proven Besi production process
  • Uniform QA system installed at contract manufacturers


X/Y placement accuracy ± 5 µm @ 3 sigma
Bond force 200 - 5,000g (50 - 5,000g option)
Die size 0.3 - 20mm (Fast CUC mode <11mm only)
Die thickness 50µm - 3mm, thinner on request
Wafer size 4" - 12" (on 8" or 12" wafer frames)
Substrate types FR4, ceramic, BGA, strip, flex, boat, leadframe
Working range 13" x 8"
Flux film thickness Various cavity plates available
Size 1,600 mm x 1,200 mm x 1,940mm (W x D x H) (with dual monitor)
Weight 2,000 kg
UPH up to 10,000 (application dependant)
Vision system 4MP, 12 x 12mm FOV


Substrate / Strip Handling

  • Input/output buffer
  • Magazine loader/unloader ML1

Vision system

  • RGB lighting
  • OCR recognition for substrates


  • Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142) 
  • Pseudo X-Ray 
  • Flip and P&P Tool Inspection 
  • Needle Hole Inspection 
  • Eject Tool Needle Inspection 
  • Eject Tool Cap Inspection 
  • Ejection System Live Cam 
  • SECS GEM Parameter Provider 
  • Wafermap Verification by Border Component 
  • Configure User Level 
  • Advanced Flux Imprint Check 
  • Chipping Inspection 
  • Auto Illumination 
  • Distributed Bonding 
  • Single Component Tracking 
  • Lot Management
  • Complete bonding
  • Custom slow travel speed/distance
  • Measure component spacing
  • Measuring component bench
  • Fluxlevel detection


Component presentation

  • Wafer stretcher (for 8" or 12" frames)
  • Various stretch adapters (for metal and plastic frames)
  • Wafer table rotation

Component handling system

  • Upgraded ionizers for TS-input-area and Eject-area)
  • Low bondforce kit (0.5 - 50N)
  • Pneumatic terminal


  • External vacuum pump
  • Uninterruptable power supply
  • ALPS Host computer
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