Multi Module Attach
Besi's advanced packaging system provides ultimate flexibility for die attach, multi-chip and flip chip applications.
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
The Datacon 2200 evo plus is a die bonder for Multi Module Attach and assembles all kinds of technologies on a tried-and-tested platform.
The all new Datacon 2200 evo hF is the ultimate multi-chip die bonding solution for high bonding force applications.
The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership.
Besi Netherlands B.V.
Tel: +31 26 319 6100
Besi Switzerland AG
Tel: +41 41 749 5111
Besi Austria GmbH
Tel: +43 5337 6000
Meco Equipment Engineers B.V.
Tel: +31 416 384 384