The Fico molding range of automatic and manual molding systems have a proven reputation for innovation, quality, reliability and high volume output. Based on experience, dating back several decades, each system has been designed to meet the challenges of today’s ever more demanding manufacturing processes. Driving forces as cost, performance and form factor are pushing molding into a new type of packages and interconnections such as Flip Chip, Exposed Die, Stacked Die and System In Package, with carriers as BGA and QFN. For all these new specific applications Besi Netherlands offers the best solution and equipment for your requirements.
Fico molding systems significantly increase yields whilst keeping cost of ownership low. On top of this, our process knowledge and process support assists you in improving your current processes and help you with the introduction of new packages.
The Fico Process Technology and Engineering department are ready to assist you in the design of your final package, in optimizing your process parameters, process reliability, process costs and selection the most suitable molding solution for your applications
Automatic and Manual
Besides automatic machines for high volume production, manual machines are available that can run production with the same molds. The manual machine is especially developed for offline cleaning and molding process parameter optimization. By making use of the original molds, new products can be developed and optimized prior to large scale production.
Besi has reinvented leadframe molding with the AMS-X and has yet again set a new benchmark in leadframe molding.
The MMS-X is the manual version of the AMS-X. Like the automatic system, it uses a newly developed plate press.
The new Fico Molding Line (FML) is a transfer molding system for wafers and large panels. It can mold wafers of up to 12" (305mm) and panels up to 300 x 340mm.
In line with the market trend of larger substrates, Besi Netherlands has introduced a new large substrate molding machine: the Fico AMS-LM. It can handle substrates of up to 102 x 280 mm.
In line with the market trend of larger substrates, Besi Netherlands has introduced a new large substrate molding machine with Top Foil functionality to mold single sided MAP products like BGA, QFN and BOC.
Besi Netherlands B.V.
Tel: +31 26 319 6100
Besi Switzerland AG
Tel: +41 41 749 5111
Besi Austria GmbH
Tel: +43 5337 6000
Meco Equipment Engineers B.V.
Tel: +31 416 384 384