Besi offers flip chip systems for mass production as well as for the high-end sector, covering a wide range of flip chip processes.
The Datacon 8800 TC advanced sets the new benchmark in Thermo Compression bonding with total process control, advanced capabilities and unsurpassed production stability.
The Datacon 8800 FC QUANTUM sigma flip chip bonder represents the next generation of the high-volume, high-accuracy 8800 platform.
The Datacon 8800 CHAMEO advanced is the pioneer multi-chip flip chip platform, enabling single pass production for higher accuracy and higher yield.
Besi Switzerland as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into the Esec 2100 FC plus die bonder.