Besi offers flip chip systems for mass production as well as for the high-end sector, covering a wide range of flip chip processes.
With its revolutionary new pick and place concept, the Datacon 8800 FC QUANTUM hS sets the new benchmark in speed and productivity for mass reflow flip chip.
The Datacon 8800 TC advanced sets the new benchmark in Thermo Compression bonding with total process control, advanced capabilities and unsurpassed production stability.
The Datacon 8800 FC QUANTUM advanced - the undisputed market leader in mass reflow flip chip.
The Datacon 8800 CHAMEO advanced is the pioneer multi-chip flip chip platform, enabling single pass production for higher accuracy and higher yield.
Besi Netherlands B.V.
Tel: +31 26 319 6100
Besi Switzerland AG
Tel: +41 41 749 5111
Besi Austria GmbH
Tel: +43 5337 6000
Meco Equipment Engineers B.V.
Tel: +31 416 384 384