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Die Attach
Multi Module Attach
Datacon 2200 evo
Datacon 2200 evo
plus
Datacon 2200 evo
hS
Datacon 2200 evo
advanced
Die Bonding
Esec 2100 SC
Esec 2100 hS
Esec 2100 hS
i
Esec 2100 sD
plus
Esec 2100 sD PPP
plus
Esec 2100 sD
advanced
i
Z-Pattern© on Esec Die Bonder 2100
Strip Mapping E142 on Esec Die Bonder
Soft Solder Die Bonding
Esec 2100 DS
Esec 2009 SSI
E
Esec 2009 fS
E
Flip Chip
Datacon 8800 TC
advanced
Datacon 8800 FC QUANTUM
advanced
Datacon 8800 FC QUANTUM
sigma
Datacon 8800 CHAMEO
advanced
Esec 2100 FC hS
Packaging
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Fico Molding Line
Fico AMS-W
Fico AMS-W Top Foil
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Fico AMS-LM Top Foil
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Fico MMS-LM Top Foil
Fico AMS-i
Fico MMS-i
Trim & Form
Fico Compact Line - P
Fico Compact Line - X
Fico Compact Line
Fico Laser Marker
Singulation
Fico Sawing Line
Accessories and Services
Process Technology
Fico Trim & Form Tools
Saw Conversion Kits
Fico Molds
Plating
Leadframe Plating
Meco ACP
Meco RTR Ag
Meco EDF/EPL
Connector Plating
Meco Connector Plating
Solar Plating
Meco DPL
Meco PPL
Meco RTR Solar
Meco CPL
Film and Foil Plating
Meco FAP
Chemistry and Tooling
Mecodeflash 100
Surclean 201 - 204
Mecorinse 500
Mecostrip Au 2
Mecostrip Ag-ID 1(Alt)
Meco EPL 4
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Financial Calendar
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Archive AGM 2018
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A Career at Besi
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Events
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Events & Shows
Financial events can be found in the separate
Financial Calendar
.
Event & Shows
28 Nov 2019
Power Electronics and Packaging Technical Workshop
Tours, France
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