Join us at SEMICON India 2025! From September 2 to 4, immerse yourself in the forefront of the semiconductor industry at this premier event. Visit us at booth 1614 to discover our latest innovations and solutions. Mark your calendar and be part of shaping the future of semiconductors!

Join us at SEMICON Taiwan 2025 at the Taipei Nangang Exhibition Center to discover the latest innovations in the semiconductor industry. Visit Besi at booth M0438 to learn how we are driving the future of semiconductor manufacturing. Don’t miss out on this premier event, mark your calendar today!

Join us at EMPC 2025 in Grenoble, France where Besi will be showcasing the latest advancements in microelectronics packaging. Register now and be a part of the premier international conference for microelectronics packaging! Booth #37.

Tomorrow’s semiconductor breakthroughs demand smarter, faster, and more efficient packaging solutions. At IMAPS 2025, Besi is unveiling the next generation of assembly and packaging technologies, built to meet the needs of AI, HPC, and heterogeneous integration. Visit us at booth no. 706 to learn more about our innovative solutions.

Discover how Besi is driving the future of semiconductor manufacturing with our innovative assembly solutions. Visit us at SEMICON West 2025 in Phoenix, booth no. 1451, to learn how our technologies can enhance your production processes and keep you ahead in the rapidly evolving tech landscape.