Join us at SEMICON Taiwan 2026 at the Taipei Nangang Exhibition Center to discover the latest innovations in the semiconductor industry. Visit the Besi booth to learn how we are driving the future of semiconductor manufacturing. Don’t miss out on this premier event, mark your calendar today!

Join us at ESTC 2026 in Helsinki, Finland where Besi will highlight its latest innovations in advanced packaging and system integration. Don’t miss the chance to connect with industry leaders and explore the future of electronics manufacturing.

Join us at SEMICON India 2026! From September 17 to 19, immerse yourself in the forefront of the semiconductor industry at this premier event. Visit us our booth to discover our latest innovations and solutions. Mark your calendar and be part of shaping the future of semiconductors!

Tomorrow’s semiconductor breakthroughs demand smarter, faster, and more efficient packaging solutions. At IMAPS 2026, Besi is unveiling the next generation of assembly and packaging technologies, built to meet the needs of AI, HPC, and heterogeneous integration. Visit our booth to learn more about our innovative solutions.

Discover how Besi is driving the future of semiconductor manufacturing with our innovative assembly solutions. Visit us at SEMICON West 2026 in San Francisco, CA, to learn how our technologies can enhance your production processes and keep you ahead in the rapidly evolving tech landscape.