Discover the latest in hybrid bonding technology at SEMI Headquarters, Milpitas, CA, on January 22-23. Don’t miss Besi’s talk: "D2W Hybrid Bonding: An Equipment Supplier Perspective."

AI, smart devices, and advanced packaging are reshaping the semiconductor landscape. At SEMICON China 2026, Besi presents its comprehensive range of assembly equipment, built to meet the highest demands of precision, scalability, and efficiency. Hall N3, booth N3645.

Discover how Besi is pioneering the future of semiconductor packaging. Join us at ECTC 2026 to learn about cutting-edge techniques that are set to revolutionize the industry.

Join Besi at the MiNaPAD conference 2026 in Grenoble, June 3 & 4. Don’t miss our presentation, "Sub micron placement accuracy – the era for heterogeneous integration and optoelectronic assemblies", showcasing cutting-edge advances in optoelectronic technology.

Join us at the heart of power electronics! Besi is excited to showcase its latest solutions and expertise at PCIM 2026. Visit us to discover how our innovative technologies are shaping the future of power electronics, intelligent motion, and energy management. Meet our experts, explore our products, and let's drive innovation together! Booth #6-430