Tomorrow’s semiconductor breakthroughs demand smarter, faster, and more efficient packaging solutions. At IMAPS 2025, Besi is unveiling the next generation of assembly and packaging technologies, built to meet the needs of AI, HPC, and heterogeneous integration. Visit us at booth no. 706 to learn more about our innovative solutions.

Discover how Besi is driving the future of semiconductor manufacturing with our innovative assembly solutions. Visit us at SEMICON West 2025 in Phoenix, booth no. 1451, to learn how our technologies can enhance your production processes and keep you ahead in the rapidly evolving tech landscape.

Join Besi at Productronica 2025 in Munich, Germany! Discover the latest advancements in electronics manufacturing at the world's leading trade fair for electronics development and production. Register now and be a part of the premier event for the electronics manufacturing industry! Hall A2 - booth 554.