Discover the latest in hybrid bonding technology at SEMI Headquarters, Milpitas, CA, on January 22-23. Don’t miss Besi’s talk: "D2W Hybrid Bonding: An Equipment Supplier Perspective."

AI-driven innovation demands breakthroughs in advanced packaging, and Besi is delivering. At SEMICON Korea 2026, we’re showcasing the next generation of Thermo Compression Bonding Equipment, built for the future of high-precision, high-efficiency semiconductor manufacturing.

Join Besi at the Wafer Level Packaging Symposium 2026 in San Francisco, February 17-19. Don’t miss the keynote presentation, "Scaling Interconnects Below 10 µm with Hybrid Bonding and Fluxless TCB", showcasing cutting-edge advances in interconnect technology.

At DPC 2026, Besi will showcase the next leap in Thermo Compression Bonding Equipment—designed for unmatched accuracy, scalability, and performance in advanced packaging applications. Be part of the conversation and explore how we are enabling the next generation of semiconductor innovation. Booth 511.

AI, smart devices, and advanced packaging are reshaping the semiconductor landscape. At SEMICON China 2026, Besi presents its comprehensive range of assembly equipment, built to meet the highest demands of precision, scalability, and efficiency. Hall N3, booth N3645.