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Datacon 8800 FC QUANTUM hs

Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield.

- Versatile High Speed Flip Chip Bonder
- Unique Quattro Concept
- Accuracy ± 4μm @ 3σ
- UPH up to 16,000

   

A Datacon QUANTUM system for your product

Seeing is believing, so we are more than happy to give you a demonstration on a live system in the Datacon QUANTUM range of flip chip equipment. Contact us today for more information.

Key Features

Extra Speed +100% Improved CoO

  • Innovative "Quattro" multi nozzle concept 
  • Synchronous process steps 
  • High resolution large FoV camera systems 
  • Cluster adjust capability for bonding position alignment
      

Accuracy

  • Proven accuracy 4μm @ 3s
  • Enhanced 26MP camera system 
  • Optimized movements with Real Cross Influence
  • New Matrix BMC 2.0 
       

Full Yield Control

  • Full Process & Production Control
  • Superior usability with enhanced Pseudo X-Ray
  • Fast Post Bond Inspection
  • Individual Eject - Flip - and P&P - Toolinspection
  • Chipping - / Die Crack detection 
     

Ease of Use

  • Minimal tooling quantity - fast device change over 
  • No die transfer shuttle - no intermediate steps
  • Simple recovery handling 
  • Auto nozzle offset correction 
        

Specifications

X/Y placement accuracy ± 4 µm @ 3 sigma
Bond force 0.5N - 15N
Die size 0.5 x 0.5 – 25 x 25mm (1.0 x 1.0 – 14 x 14mm (high speed mode))
Die thickness 0.05 - 2mm
Wafer size 8" - 12" (on 8" or 12" wafer frames)
Substrate types FR4, ceramic, BGA, strip, flex, boat, leadframe
Working range 325 x 203mm
Flux film thickness Various cavity plates available
Size 1,600 x 1,983 x 1,940mm (W x D x H) (with dual monitor)
Weight Ca. 2,000 kg
UPH up to 16,000 (application dependant)
Vision system WC/UC: FoV 29 x 29 mm, SC: FoV 16 x 16 mm

Options

Substrate / Strip Handling

  • Input/output buffer
  • Magazine loader/unloader ML1
      

Vision system

  • RGB lighting
  • OCR for substrates
     

Software

  • Functionality via existing standard SECS/GEM protocol
  • Pseudo X-Ray 
  • Needle Hole Inspection 
  • Flip and P&P Tool Inspection 
  • Parameter provider
  • Configurable user level
  • Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142) 
  • Chipping Inspection 
  • Lot Management
  • Restart Dialoge Region Selection
  • Auto Illumination
  • Custom Slow Travel Speed and Distance
  • Single Component Tracking
  • Cleartext Process Program (read only)
  • Single Chip / Multiple Bond Positions
      

Component presentation

  • Wafer stretcher (for 8" or 12" frames)
  • Various stretch adapters (for metal and plastic frames)
  • Wafer table rotation
     

Component handling system

  • Upgraded ionizers for TS-input-area and Eject-area
  • Pneumatic terminal
     

Others

  • External vacuum pump
  • Uninterruptable power supply
  • ALPS Host computer
      
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