The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) is the premier international event dedicated to electronics packaging and system integration. Held every two years in Europe, and supported by the IEEE Electronics Packaging Society (IEEE-EPS) in association with IMAPS Europe, ESTC brings together leading experts, researchers, and industry professionals to explore the latest advancements and innovations in the field.

Taking place in Helsinki, Finland, IEEE ESTC 2026 will feature a comprehensive program of technical sessions, keynote presentations, panel discussio, and networking opportunities. Topics will span a broad spectrum of electronics system integration technologies, including advanced packaging, heterogeneous integration, 3D and wafer-level packaging, materials and processes, reliability, and emerging system architectures.

Besi is proud to participate as a Silver Sponsor of IEEE ESTC 2026. We look forward to showcasing our cutting-edge packaging and assembly solutions, engaging with industry leaders, and contributing to the collaborative exchange of knowledge that drives innovation in semiconductor manufacturing.

Join Besi and other global leaders at ESTC 2026 in Helsinki to experience the forefront of electronics system integration technology and to connect with the community shaping the future of the industry.

Helsinki, Finland | September 9-11, 2026

https://www.estc-conference.net/

We look forward to seeing you in Helsinki!