The 3D & Systems Summit 2026, taking place from June 17 to 19 in the historic city of Dresden in Germany, is an unmissable event for professionals and innovators in the field of semiconductor technology and 3D integration.

Attending this summit offers you the chance to engage with industry leaders and experts who are shaping the future of technology. You will gain insights into the latest trends and geopolitical dynamics affecting the market, explore cutting-edge applications of chiplet architectures, and discover how hybrid bonding is revolutionizing 3D integration. Sessions on photonics, sustainability, and European readiness will equip you with the knowledge needed to navigate the evolving landscape of semiconductor technology.

Moreover, the summit provides an invaluable platform for networking. Connect with peers, share ideas, and foster collaborations that can drive innovation in your organization. Whether you are a seasoned professional or new to the field, the knowledge and connections you gain at this event will be instrumental in propelling your career and your organization forward.

Don’t miss this chance to be at the forefront of technological advancements. Visit the Besi booth to learn more about our innovative solutions and attend our keynote session to gain insights that can transform your approach to semiconductor technology. Join us in Dresden and be part of the conversation that will define the future of heterogeneous systems. Secure your spot today!

Dresden, Germany | June 17-19, 2026 

https://www.semi.org/eu/connect/events/3d-and-systems-summit