MiNaPAD 2026 is a premier 2-day conference and exhibition dedicated to advancing the micro and nano-electronics packaging, assembly, design, and manufacturing sectors. The event aims to strengthen collaboration and knowledge exchange between the design community - which represents the largest segment of the European semiconductor industry - and the assembly and packaging community.

Key Components:

• Parallel Technical Sessions:
  Focused discussions and presentations on cutting-edge research, innovative design methodologies, packaging technologies, and manufacturing processes.
• Exhibition:
  Showcase of the latest tools, equipment, materials, and services from leading industry players and research institutions.
• Additional Technical Events:
  Workshops, panel discussions, and networking opportunities designed to foster collaboration and address current challenges in the semiconductor packaging and design ecosystem.
     

Objectives:  

• Reinforce the synergy between design and packaging communities.
• Promote knowledge sharing and innovation in micro/nano-electronics manufacturing.  
• Highlight emerging trends and technologies shaping the future of semiconductor assembly and design.