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30 Apr 2014

Q1-14 Profit and Orders Up 87% and 74% vs. Q1-13. Strong Demand for Advanced Packaging Systems in Smart Phone, Tablet and Automotive Applications

Duiven, the Netherlands, April 30, 2014 - BE Semiconductor Industries N.V. ("the Company" or "Besi") (NYSE Euronext: BESI; OTCQX: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the first quarter ended March 31, 2014.

Key Highlights

  • Revenue of € 70.0 million up 31.9% vs. Q4-13 and 9.3% vs. Q1-13. Exceeds guidance
  • Gross margins increase to 42.3% vs. 40.1% in Q4-13 and 39.6% in Q1-13
  • Orders up 94.2% vs. Q4-13 and 74.0% vs. Q1-13. Strength in flip chip, TCB and multi module die attach and ultra-thin molding systems for smart phones, tablets and automotive applications
  • Net income of € 7.0 million vs. € 1.4 million in Q4-13 and € 3.8 million in Q1-13 due primarily to revenue growth, higher gross margins and cost control efforts
  • Net margin reached 10.0% in Q1-14 vs. 5.9% in Q1-13 reflecting increased profitability of Besi's business model



  • Q2-14 revenue up 40-50% vs. Q1-14 reflecting improved industry outlook. Significant sequential profit growth anticipated due to strong revenue development and margin expansion


To read the full version of our press release, please download the PDF file.

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