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Die Attach
Multi Module Attach
Datacon 2200 evo
Datacon 2200 evo
plus
Datacon 2200 evo
hF
Datacon 2200 evo
hS
Datacon 2200 evo
advanced
Die Bonding
Esec 2100 hS
ix
Esec 2100 sD
advanced
i
Esec 2100 hS
i
Esec 2100 hS
Esec 2100 SC
Strip Mapping E142 on Esec Die Bonder
Soft Solder Die Bonding
Esec 2009 SSI
E
Esec 2009 fS
E
Flip Chip
Datacon 8800 FC QUANTUM
hS
Datacon 8800 TC
advanced
Datacon 8800 FC QUANTUM
advanced
Datacon 8800 CHAMEO
advanced
Esec 2100 FC hS
Packaging
Molding
AMS-X
MMS-X
Fico Molding Line
Fico AMS-LM
Fico AMS-LM Top Foil
Fico MMS-LM
Fico MMS-LM Top Foil
Fico AMS-i
Fico MMS-i
Trim & Form
Fico Compact Line - X
Fico Compact Line - P
Singulation
Fico Sawing Line
Accessories and Services
Process Technology
Fico Trim & Form Tools
Saw Conversion Kits
Fico Molds
Plating & Cleaning
Leadframe wet processing
Meco CDL 1500
Meco FXL
Leadframe Plating
Meco ACP
Meco RTR Ag
Meco EDF/EPL
Connector Plating
Meco Connector Plating
Solar Plating
Meco DPL
Meco PPL
Meco RTR Solar
Meco CPL
Film and Foil Plating
Meco FAP
Chemistry and Tooling
Mecodeflash 100
Surclean 201 - 204
Mecorinse 500
Mecostrip Au 2
Mecostrip Ag-ID 1(Alt)
Meco EPL 4
EU projects
Scientific publications
Smart manufacturing
Wettable flank
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2024
2023
2022
2021
2020
2019
2018
2017
2016
2015
2014
Share Repurchases
Share Repurchase Program
Financial Reports and Publications
(Semi) Annual Reports and XBRL packages
ESG Reports
Investor Presentations
Webcast Presentations
Replays Webcasts & Webinars
Financial Calendar
Past Investor Events
Annual General Meeting
AGM 2024
Archive AGM 2023
Archive AGM 2022
Archive AGM 2021
Archive AGM 2020
Share Information
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Events
Events & Shows
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A Career at Besi
People & Diversity
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Technology Leadership
Compensation and Benefits
Flexible Work Arrangements
Electronic Industry Citizenship Coalition Compliance
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Events
Events & Shows
Roadshow Stockholm, organized by ING
Events & Shows
Events & Shows
14 Sep 2023
Roadshow Stockholm, organized by ING
(Stockholm, Sweden)
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