Join us at SEMICON Taiwan 2026, September 2 to 4 at TaiNEX 1 & 2. This premier semiconductor exhibition will feature over 1,100 leading companies and more than 4,000 booths, attracting over 100,000 industry professionals. It's an unparalleled opportunity for networking and collaboration.

Besi is excited to participate and we will showcase our latest innovations and solutions that are shaping the future of the semiconductor industry. This year’s exhibition will highlight 13 key technology trends, including AI chips, advanced packaging, 3DIC, chiplets, and heterogeneous integration. By visiting our booth, you'll gain insights into how Besi is driving innovation and efficiency in semiconductor manufacturing.

SEMICON Taiwan 2026 is your chance to engage with key players in IC design, wafer fabrication, equipment manufacturing, and materials R&D. Whether you’re looking to stay ahead of market trends or seeking collaborative opportunities, this event is your gateway to the latest technological breakthroughs in the semiconductor landscape. Don’t miss the chance to connect with Besi and other industry leaders, mark your calendar and visit us at booth M0438.

Taipei, Taiwan | September 2-4, 2026 | Booth M0438

https://semicontaiwan.org/en